Ic Packaging Integration Engineer jobs at Apple in United States, Cupertino
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Company (1)
Job type
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Job title (1)
United States
State
Cupertino
1,465 jobs found
31.05.2024
A
Apple IC Packaging Integration Engineer United States, California, Cupertino
We are looking for someone experienced in the semiconductor packaging and/or system integration. Good understanding of multi-functional packaging areas: package layout and architecture, enabling process technologies, thermal, mechanical, SI/PI, material,...
We are looking for someone experienced in the semiconductor packaging and/or system integration. Good understanding of multi-functional packaging areas: package layout and architecture, enabling process technologies, thermal, mechanical, SI/PI, material,...
Proven capability in mechanics and mathematics. Hands-on experience of major FEM tools (e.g., ANSYS, ABAQUS, Hypermesh, etc.). Proficiency with numerical simulation software tools and expert in Matlab and/or Scientific Python....
Proficiency with major mechanical design CAD tools, such as Siemens NX, AutoCAD, SpaceClaim, SolidWorks, etc. Proven capability of setting up equipment and data acquisition systems. Hands-on experience of major material...
Proven capability in mechanics and mathematics. Hands-on experience of major FEM tools (e.g., ANSYS, ABAQUS, Hypermesh, etc.). Proficiency with numerical simulation software tools and expert in Matlab and/or Scientific Python....
We are looking for someone with experience in Semiconductor Packaging Design, Process & Technology Development. Good understanding of cross-functional packaging areas: Si floor plan, package layout and architecture, enabling process...
We are looking for someone with experience in Semiconductor Packaging Design, Process & Technology Development. Good understanding of cross-functional packaging areas: Si floor plan, package layout and architecture, enabling process...
We are looking for someone experienced in the semiconductor packaging and/or system integration. Good understanding of multi-functional packaging areas: package layout and architecture, enabling process technologies, thermal, mechanical, SI/PI, material,...
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