Qualcomm PWB Designer - Staff 

United States, California, San Diego 

908910048

Job Area:

Engineering Services Group, Engineering Services Group > PWB Design

The successful candidate will operate as a member of the Corporate Engineering unit, PWB CAD department, and will be able to design and document printed wiring board layouts that conform to manufacturing and industry standards and Qualcomm design guidelines. Working in close coordination with electrical and mechanical design teams from supplied schematics and electrical and mechanical design constraints to develop PWB layouts that meet all project goals and requirements for a variety of new 5G & 6G designs across multiple business units (R&D, Mobile, Compute, IOT, Infrastructure, Automotive, Test Equipment).

- 'form factor accurate' (FFA) test platform high volume circuit boards. These boards require mastery in digital processors, RF, and radio circuits as well as power control devices. Experience with micro-vias (stacked), sequential lamination stack-ups and design rules using .5mm pitch and smaller packages. Responsibilities include working with US and India teams to provide PWB design solutions for high performance electronic assemblies for Mobile, Modem, Auto, Compute, Infrastructure and IOT.

Minimum Qualifications:

• Associate's degree in Electrical Engineering, Computer Science, Mathematics, or related field and 7+ years of PCB layout handling or related work experience.

High School diploma or equivalent and 9+ years of PCB layout handling or related work experience.

Preferred Qualifications:

• 8+ years actively involved in PWB design for high-density electronics packaging.

• 4+ years experience in a PWB design role designing consumer-grade mobile products or low volume test products utilizing latest generation processor chips & ICs.

• Design for Manufacture (DFM) analysis experience utilizing Valor and/or CAM350 tools.

• Knowledge of large/high density digital designs having high layer counts (24-34 layers) and containing several FPGA's (>1500 pins) along with very high-speed digital signals.

• Mastery in digital processors, RF and radio circuits as well as power control devices.

• Experience with micro-vias (stacked), sequential lamination stack-ups and design rules using .35 mm pitch and smaller packages.

• Design for Manufacture (DFM) analysis experience utilizing Valor and/or CAM350 tools.

• Preferred design experience: RF, Analog, High-speed digital circuits - DDR2, 3 & 4, LPDDR5, HDMI, PCIe, SATA, MIPI, USB 2,3.x, GigE

• Able to perform complex and difficult PWB design tasks requiring extensive skill and knowledge of fabrication and assembly process capabilities and limitations.

• Effectively multitasks and meets aggressive schedules in a dynamic environment.

• Determine PWB design trade-offs necessary to meet design requirements and produce high quality cost effective PWB’s that meet schedule objectives.

• Understands the requirements driving PWB technology and process trends and their application to Qualcomm designs.

• Maintain technical coordination with Engineering and Manufacturing. Resolve PWB design issues with fabrication and assembly vendors.

• Participate and provide input into process improvement, PWB and DFM checklists and guidelines.

• Participates in determining objectives of assignment and plans, schedules, and arranges own activities in accomplishing objectives.

• Experience working with various EMI mitigation techniques and practices.

• Experience with IDF/EMN file exchange between mechanical and HW teams.

• Understands project goals and individual contribution toward those goals.

• Effectively communicates with project peers and engineering personnel via e-mail, web meetings, and instant messaging including status reports and illustrative presentation slides.

• Interact and collaborate with other internal PWB designers for optimal product development processes and schedule execution.

• Effectively multitasks and meets aggressive schedules in a dynamic environment.

• Prepare and deliver design reviews to project team.

• Possess excellent verbal and written communication skills

• Leadership skills to help direct, prioritize, and clearly set project tasks per schedule. Communicate milestones and directions to outside team members.

Principal Duties and Responsibilities:

• Independently develops and executes complex designs and optimizes design cycle based on advanced knowledge of printed wiring board design processes, methodology, and tools. Reviews and provides feedback on designs and oversees execution.

• Gathers, reads and interprets schematics, blueprints, and technical documents to understand and provide feedback on complex requirements, information, and specifications.

• Performs placement and routing of complex circuit boards and reviews work of others.

• Develops complex fabrication drawings and other relevant documentation, using knowledge of PWB Standard Notes and Manufacturing Design Guidelines.

• Conducts final review of completed design with all stakeholders. Incorporates complex recommended changes to the layout and gain approvals to proceed.

• Perform limited simulations for own and team members' designs.

• Diagnoses and troubleshoots complex technical issues and recommends solutions.

• Manages complex data for multiple projects and leads advanced analyses to identify and resolve abstract issues.

• Works across teams and with fabrication vendors and engineers to integrate complex projects and/or ensure changes work with other components of a specific project.

• Manages team project priorities, deadlines, and deliverables for large and/or multiple projects.

Level of Responsibility:

• Works independently with little supervision.

• Provides supervision to direct reports.

• Decisions are more significant in their impact, influencing overall program or project success, finances, and/or the ability to meet objectives. Errors are not readily apparent due to the complexity of work process/product or time between decisions and results. Errors typically result in significant expenditure of time, resources, and funds to correct.

• Requires verbal and written communication skills to convey complex and/or detailed information to multiple individuals/audiences with differing knowledge levels. Role may require strong negotiation and influence, communication to large groups or high-level constituents.

• Has a moderate amount of influence over key organizational decisions (e.g., is consulted by senior leadership to make key decisions).

• Most tasks require multiple steps which can be performed in various orders; tasks require simultaneously executing multiple cognitive abilities and maintaining information in short or long-term memory while performing the task.

• Exceptional creativity is needed to innovate new ideas and develop innovative products/ processes without established objectives or known parameters.

• Deductive and inductive problem solving is required; multiple approaches may be taken/necessary to solve the problem; often information is missing or conflicting; advanced data analysis and interpretation skills are required.

• Occasionally participates in strategic planning within own area affecting immediate operations.

The responsibilities of this role do not include:

• Does not have financial accountability.

Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.

Pay range:

$50.10 - $75.14