Packaging Technician jobs

What We Offer

Swing

Key Responsibilities

• Performs complex electro-mechanical technical functions and activities such as design, test, checkout, fabrication, modification, troubleshooting and assembly of electronics and electro-mechanical systems, experimental design circuitry, prototype models, specialized test equipment, tools and test fixtures.
• Tests and troubleshoots system level and component level problems in electrical and mechanical systems and sub-systems with minimal supervision. Assignments require solution of difficult problems by application of technical knowledge. May perform more complicated or complex new system and NPI installations and field upgrades.
• May work from limited or no documentation. Investigates, compiles data, documents and recommends changes using applicable reporting process to enhance product performance.
• Compiles logbooks and test procedures documentation utilizing good writing skills. Assists in revising, developing and implementing documented procedures. Writes complex technical reports and test procedures.
• Performs mechanical, electrical, pneumatic & vacuum and process testing on AMAT platforms to Engineering and Manufacturing documentation and specifications.
• Observes all safety standards. Maintains a secure, safe, clean and healthy work environment. Attends required health and safety training and follows safety and security policies, procedures and practices. Promptly reports accidents, injuries, safety hazards, or emergencies to supervisor or Safety dept. Follows operating instructions, uses protective equipment when required, and uses equipment and materials properly. Actively strives to prevent accidents and injuries.
• Requires full understanding of the company's manufacturing and/or engineering processes, as well as excellent interpersonal and communication skills to effectively interface acrossdepartmental/functionallines. Provides management with technical input in order to correct problems both at the system level and in the manufacturing process.
• Provides training to lower level Engineering Technicians. Recognized as technical resource for a particular platform or product. Highly proficient at troubleshooting and resolving issues. Effective at providing standard work and workmanship skills training. Works closely with Engineering in the development of procedures and documentation for NPI. May serve as a "Quality Lead".

Functional Knowledge

• Has developed advanced specialized expertise within aanalytical/scientificarea to perform the most complex work
• Experience with PVD , CVD, and or Etchis required.

Business Expertise

• Has a good understanding of how related teams coordinate their efforts and resources to achieve objectives

Leadership

• May act as a lead for the team, may allocate work and provide subject matter guidance to more junior team members

Problem Solving

• Exercises judgment, based on previous experience, practices and precedents, to identify and solve problems that arise with little or no precedent

Impact

• Impacts the effectiveness of own team and closely related teams

Interpersonal Skills

• Exchanges ideas and information effectively; uses tact and diplomacy when dealing with others

Key Responsibilities

Performs Tier I procedures and preventative maintenance and wet-cleans, seeking assistance when needed.

Assists senior engineers with corrective maintenance as needed.

Disassembles, cleans and rebuilds kits as part of kit management quality.

Learns and applies basic diagnostic techniques and the use of documentation and test equipment with assistance from senior engineers.

Able to diagnose and resolve basic technical problems.

Complies with all safety procedures and consistently demonstrates safety as a value.

Other Requirements: This is a physically demanding position that often requires extensive walking, standing for extended periods of time, working in tight spaces, bending, squatting, twisting, kneeling, reaching, climbing stairs and ladders, lifting up to 35 lbs., the ability to distinguish between colors, the ability to work in an environment with noise that may be difficult for some individuals with sensitivity to noise, and the use of hand and powertools. Additionally,because this position generally involves working in a clean room, it requires the use of appropriate Personal Protective Equipment such as coveralls, hoods, booties, safety glasses, gloves, respirators, chemical aprons, and face shields.

Functional Knowledge

• Applies basic analytical skills or scientific methods or operational processes to perform straightforward activities

Business Expertise

• Understands how the assigned duties relate to others in the team and how the team integrates with others

Leadership

• Has no supervisory responsibilities

Problem Solving

• Uses standard operating procedures or scientific methods to guide own work and solve standard problems

Impact

• Impacts own work

Interpersonal Skills

• Uses communication skills to exchange information

• Lead and manage a team of silicon physical design engineers responsible for end-to-end silicon design engineering activities supporting technology development, and product design execution on EMIB 2.5D/3.5D, Foveros S/R/B, and Foveros Direct 3D Intel foundry advanced packaging technologies.

• Oversee planning, scheduling, and execution of design projects, ensuring milestones and deadlines are met.

• Drive continuous improvement in design methodologies, flows, and processes to enhance quality and efficiency.

• Collaborate with cross-functional teams (technology partners, packaging, analysis, and verification) to ensure seamless integration and manufacturability.

• Provide technical leadership and mentorship, fostering a culture of innovation and accountability.

• Responsible for enabling teams to execute through clear goal setting, facilitating work, maintaining accountability, applying differentiated performance management, and driving team results.

• Drives results by inspiring people, role modeling Intel values, developing the capabilities of others, and ensuring a productive work environment.

Key Responsibilities:

Leadership and Management

• Lead and manage a group of Silicon Packaging Engineers, providing guidance, mentorship, and support to ensure the successful execution of projects.

• Oversee the planning, scheduling, and execution of package design projects, ensuring that milestones and deadlines are met.

• Foster a collaborative and innovative team environment, encouraging continuous learning and professional development.

• Lead design groups, coordinating efforts across multiple teams to achieve project goals.

Technical Expertise

• Serve as the technical lead for the package design team cross multiple products.

• Drive the development of advanced packaging designs, ensuring compliance with industry standards and best practices.

• Collaborate with cross-functional teams, including package architects, silicon and board design teams, design rule owners, electrical analysis engineers, and integration teams to define and implement design specifications.

• Leverage extensive experience in advanced packaging designs to meet design KPIs.

• Influence.

• Ensure products are designed and developed with high quality standards by overseeing design processes, risk management, and compliance throughout the product design lifecycle, working closely with cross-functional teams to identify and address potential quality issues before they arise.

Project Management

• Develop and maintain detailed project plans, including resource allocation, risk management, and progress tracking.

• Coordinate with stakeholders to ensure alignment on project goals, deliverables, and timelines.

• Conduct regular project reviews and provide status updates to senior management.

Innovation and Improvement

• Identify and implement process improvements to enhance the efficiency and quality of package designs and development.

• Stay current with industry trends and emerging technologies, incorporating new methodologies and tools into the design process.

• Drive innovation in product design, exploring new approaches and techniques to achieve competitive advantages.

The ideal candidate should exhibit the following behavioral traits:

• Excellent leadership and team management skills, with the ability to inspire and motivate a diverse team of engineers.

• Strong project management skills, with the ability to manage multiple projects simultaneously and meet deadlines.

• Exceptional problem-solving and analytical skills, with a keen attention to detail.

• Excellent communication and interpersonal skills, with the ability to collaborate effectively with cross-functional teams and stakeholders.

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications:

• Bachelor's degree in Electrical Engineeringor STEM related field with 9+years of relevant experience

• -OR- Master's degree in Electrical Engineeringor STEM related fieldwith 6+ years ofrelevant experience

• -OR- PhD in Electrical Engineeringor STEM related fieldwith 4+ years of relevant experience

Relevant experience should include the following:

• Experience in silicon design, with at least 3 years in a leadership role.

• Proven experience in a leadership or management role, with a track record of successfully leading engineering teams and delivering complex projects withinestablished timelines.

• Experience with design flows and methodologies (physical design, verification).

• Experience working with EDA tools from Cadence, Synopsys, and/or Siemens.

Preferred Qualifications:

• Experience with advanced nodes and packaging technologies

• Experience in RTL2GDS flows and methodologies

Weoffer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here:

Role Responsibilities:

• Use work orders (including schematics, wiring diagrams, parts lists, and instructions) to build, repair and/or test equipment of various kinds (electrical, electro-mechanical, vacuum, pneumatic assemblies, subassemblies and components)
• Perform a wide variety of electro-mechanical assembly operations, troubleshooting and repairs
• Receive parts and perform audits to ensure all necessary parts are available and free of defects
• Use test fixtures, electronic measurement equipment, leak detectors and/or vacuum pumps to test assemblies, subassemblies and components
• Complete required job documentation (data entry) about progress, work expense and labor details; perform computer programming, repair or software installs, as needed
• Work closely with engineering on developing and proposing new processes and procedures, and provide input on new product design and integration
• Provide training and support to lower-level technicians; assist supervisor in aligning resources for daily production needs
• Serve as a Quality Lead for processes, as needed; assist with quality issues at customer sites and provide feedback to improve manufacturing processes

Minimum Qualifications:

• An Associate’s degree
• 4–7 years of semiconductor or display experience, or comparable industry or military experience
• Specialized expertise within ananalytical/scientificarea for performing complex work

Preferred Qualifications:

• Demonstrated proficiency in multiple semiconductor manufacturing concepts and processes
• Ability to operate as a senior technical leader and present projects with minimal supervision
• Proven and capable people leadership (of teams 5+)
• Willingness to travel (up to 10%) to support teams, as needed
• ASSEET
• BSEET (DeVry, TSTC)

This is a physically demanding position that often requires standing for extended periods of time, walking, working in tight spaces, bending, squatting, twisting, kneeling, reaching, climbing stairs and ladders, lifting, the ability to distinguish between colors, the ability to work in an environment with noise that may be difficult for some individuals with sensitivity to noise, the use of hand and power tools, and driving or operating heavy machinery including forklifts. Additionally, because this position may involve working in a clean room, the use of appropriate Personal Protective Equipment such as coveralls, hoods, booties, safety glasses, gloves, respirators, chemical aprons, and face shields may be required.

Role Responsibilities:

• Use work orders (including schematics, wiring diagrams, parts lists, and instructions) to build, repair and/or test equipment of various kinds (electrical, electro-mechanical, vacuum, pneumatic assemblies, subassemblies and components)
• Perform a wide variety of electro-mechanical assembly operations, troubleshooting and repairs
• Receive parts and perform audits to ensure all necessary parts are available; inspect parts for defects; troubleshoot and improve processes
• Use test fixtures, electronic measurement equipment, leak detectors and/or vacuum pumps to test assemblies, subassemblies and components
• Complete required job documentation (data entry) about progress, work expense and labor details; perform computer programming, repair or software installs, as needed
• Work independently with minimal supervision, and serve as an informal resource for junior colleagues

Minimum Qualifications:

• An Associate’s degree
• 2–4 years of semiconductor or display experience, or comparable industry or military experience
• Related technical trainings and certifications

Preferred Qualifications:

• Solid analytical skills, and an ability to problem-solve using established operating procedures or scientific methods
• Demonstrated capability to operate as a peer leader and trainer
• Demonstrated proficiency for required semiconductor manufacturing concepts and processes
• ASSEET
• BSEET (DeVry, TSTC)

This is a physically demanding position that often requires standing for extended periods of time, walking, working in tight spaces, bending, squatting, twisting, kneeling, reaching, climbing stairs and ladders, lifting, the ability to distinguish between colors, the ability to work in an environment with noise that may be difficult for some individuals with sensitivity to noise, the use of hand and power tools, and driving or operating heavy machinery including forklifts. Additionally, because this position may involve working in a clean room, the use of appropriate Personal Protective Equipment such as coveralls, hoods, booties, safety glasses, gloves, respirators, chemical aprons, and face shields may be required.

Key Responsibilities:

• Lead the co-design of silicon and package, focusing on DDR PHY and mixed signal IP integration for server SOCs.
• Design bump maps, floor plans, and manage area constraints for PHYs, collaborating closely with packaging technical experts.
• Conduct hands-onpackage extractionsand simulations(signal integrity, power integrity)
• Finalize bump-out, floor plan, and area decisions at the end of tech readiness phases.
• Interface with packaging teams on advanced technologies (e.g., C4 bumps, micro bumps, EMIB, hybrid bonding as needed).
• Focus on design, development, and architecture, not process or materials engineering.

Required Experience:

• Experience in both silicon design (preferably mixed signal/analog) and packaging co-design.
• Background in DDR, SOC, or similar high-speed interface development.
• Hands-on expertise with bump mapping, floor planning, and packaging constraints.
• Proven ability to collaborate across silicon and packaging teams, including risk assessment and simulation.
• Familiarity with advanced packaging technologies (hybrid bonding, EMIB, etc.) is a plus but not required.
• Individual contributor or principal engineer level preferred; management experience is not required.
• Experience at leading companies in advanced packaging and PHY design (e.g., Apple, Broadcom, Qualcomm, Micron, AMD, Nvidia).

• Bachelors in electrical engineering, chemical engineering, mechanical engineering, material science or similar field (Master’s or Ph.D. preferred).
• 10+ years in silicon and packaging co-design

Weoffer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here: