Packaging jobs in Israel

The NVIDIA Networking Business Unit is seeking a highly motivated and experienced Packaging Engineer to join our team. In this critical role, you will be responsible for developing, managing, and implementing product packaging solutions, focusing specifically on NVIDIA network products. The role involves analyzing packaging requirements and developing innovative approaches to packaging design and production, ensuring that the product fits the company’s business objectives and satisfies customer requirements. You will work closely with cross-functional teams to determine the packaging costs, implement sustainable packaging solutions, and find ways to improve quality, profitability, and product delivery.

NVIDIA Networking Division is a leading supplier of innovative end-to-end InfiniBand and Ethernet connectivity solutions and services for servers and storage. We offer market-leading solutions that include adapter cards, switches, cables and software to support networking technologies. Our products optimize data center performance and deliver industry-leading bandwidth and scalability. In addition, we serve a wide range of markets including high performance computing, enterprise, data centers, cloud computing, big data and Web 2.0. We are constantly reinventing ourselves to stay ahead of the market and bring groundbreaking products and services to the industry. Our product line is focusing on delivering the most optimized Ethernet solutions for industries like Media and Entertainment as well as any other industry that can benefit from our Datastream and TCP/IP acceleration.

What you will be doing:

• Create packaging specifications and testing protocols

• Collaborate with cross-functional teams to ensure packaging meets product and shipping requirements

• Evaluate packaging materials and suppliers

• Ensure packaging compliance with industry regulations

• Work on reducing packaging-related costs and improving the efficiency of the product packaging process

• Maintain packaging-related documentation and records

• Manage packaging projects and timelines

• Lead regular working sessions and status meetings to track timeline, deliverables, materials, orders, test status,and blockers. Ensure alignment across functions and escalating issues as needed.

• Proactively identify risks and issues that could impact project delivery, and work with collaborators to develop mitigation plans.

• Ensure all relevant project documentation - including requirements, decisions, timelines, project progress, risks, and important decisions/action items .

What we need to see:

• Bachelor's degree in industrial design, materials science, mechanical engineering or related field

• 5+ years of experience in packaging design and development

• Strong understanding of packaging materials, manufacturing processes, and testing procedures

• Excellent project management and communication skills

• Sharp thinking and good decision-making skills

Ways to stand out from the crowd:

• Proficiency in CAD software and other design tools

• Knowledge of industry regulations and standards (ISTA, ASTM)

• Ability to work independently and in a team environment

What you will be doing:

• Leading development of cutting-edge microelectronics packaging of NVIDIA Networking Business Unit’s future products, evaluating NVIDIA products for reliability and performance.

• Review manufacturability readiness at each milestone.

• Work with world leading vendors to develop highly challenging packaging solutions.

• Leading the development of groundbreaking microelectronics packaging for NVIDIA Networking Business Unit's future products

• Collaborating with world-leading vendors to develop highly ambitious packaging solutions

• Thriving in a dynamic and challenging environment

• Join and lead task forces to investigate and support production excursions, failure analysis and reliability issues and establish quality standards.

• Monitor substrate and assembly production KPIs and collaborate with cross functional teams to define and monitor Yield Improvement Plans for continuous improvement and establish quality standards.

• Lead process changes reviews, prepare and present data in Change Control Board meetings, lead technical reviews of product changes throughout the supply chain.

What we need to see:

• BSc or equivalentMechanical/Material Engineering degree, or any related equivalent experience.

• 3+ years of relevant work experience in the semiconductor packaging or equivalent experience, development and manufacturing.

• Basic design skills, such as using 2D ArtiosCAD, and 3D NX/SolidWorks/Creo applications.

• Experience in DFM, understand tooling design, manufacturing processes, material properties and metrology tools.

• High awareness for quality, robustness, and manufacturability.

• High self-learning and self-motivation skills, fostering a culture of continuous learning, ongoing process improvement and proactive approach.

• Leadership skills, capability to lead cross company projects that involve cross functional teams in different locations.

• Curious and creative problem solver, well organized and multi-tasker.

Ways to stand out of the crowd:

• Hands-on FEA mechanical simulation experience - Advantage

• Team / Group / Project management - Advantage

• Experience with manufacturing environment and manufacturing statistics tools

• Background in engineering semiconductor manufacturing processes

What you’ll be doing:

• Design, implement, and maintain installation and packaging workflows for NVIDIA networking software across major Linux distributions (Debian, Ubuntu, RHEL, SLES, etc.).

• Develop and support meta-packages, profiles, and tools to streamline user-space installation and configuration.

• Work with distribution maintainers to ensure compatibility and smooth delivery through native packaging systems (DEB, RPM).

• Perform system-level testing and verification of package installations on various platforms and OS versions.

• Collaborate with cross-functional teams (kernel, QA, release engineering, and support) to ensure installation quality and maintainability.

• Contribute to Linux kernel driver development and backporting to support advanced networking features.

What we need to see:

• BS in Computer Science, Computer/Software Engineering, or a related field.

• 5+ years of software development experience, with strong focus on Linux system-level development.

• Proficiency in Linux package management systems (dpkg, RPM, yum, apt, zypper) and scripting languages such as Python or Bash.

• Experience with packaging standards, automation tools, and release workflows.

• Familiarity with kernel backporting, patch management, and driver installation (a plus).

• Excellent communication and collaboration skills with a customer-focused mindset.

• Strong debugging and troubleshooting skills, especially across varied Linux environments .

Ways to stand out from the crowd:

• MS in Computer Science, Electrical Engineering, or a related field.

• Deep knowledge of Linux operating systems and distribution lifecycle management.

• Experience contributing to public Linux distributions or upstream projects.

• Familiarity with cloud or containerized environments (e.g., Docker, Kubernetes).

• Experience supporting large-scale deployment environments in data center or HPC settings.