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Senior Engineer Packaging Developing Engineering jobs at Western Digital in Philippines, Baguio
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Philippines
Baguio
96 jobs found
04.09.2024
WD
Western Digital Senior Engineer Packaging Developing Engineering Philippines, Baguio
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Die Preparation (DP) process evaluation for ASIC wafer, flip chip wafer and 3D NAND wafer assembly. New DP process recipe development to achieve high quality product and cost down. New...
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02.09.2024
WD
Western Digital Senior Engineer Manufacturing Engineering Philippines, Baguio
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To develop and implement for new cleaning technology to meet the new customer requirement. To improve the yield, more reliable and robust process, and cycle time of cleaning process. To...
01.09.2024
WD
Western Digital Senior Engineer Test Engineering Philippines, Baguio
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Support BE Media test (PZT, TDS, Magnetic Certification) process. Support FE and BE AOI process. Certify new head and transfer into back end test operation. Media BE test vs HDD...
02.09.2024
WD
Western Digital Senior Engineer Failure Analysis Engineering Philippines, Baguio
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Lead Electrical Failure Analysis (Defect Scanning/Mapping) and Surface Area Test (SAT) improvement activity in Sustaining product. Engage in early HAMR products ramp-up to accelerate SAT and Tribology improvements. Review Failure...
02.09.2024
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Western Digital Senior Engineer Industrial Engineering Philippines, Baguio
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Productivity improvement project: Lead in cost saving projects such as Productivity improvement, cycle time improvement, MMR improvement, etc. to meet company goals. Capacity planning and analysis to meet the volume...
03.09.2024
WD
Western Digital Senior Engineer Supplier Quality Engineering Philippines, Baguio
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Apply Data Analytic & ML skill and technique to;Monitor and provide insights based on supplier’s data.Feedback to team in case of any abnormality found and follow up till closure. Monitor...
03.09.2024
WD
Western Digital Staff Engineer Firmware Engineering Philippines, Baguio
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Work with electrical engineers to define electronic circuit design. Design firmware system architecture and develop relevant functions in firmware. Research test algorithm and implement the test algorithm in firmware and...
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Description:Full job details
Die Preparation (DP) process evaluation for ASIC wafer, flip chip wafer and 3D NAND wafer assembly. New DP process recipe development to achieve high quality product and cost down. New...
These jobs might be a good fit
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