High Voltage Packaging Engineering Manager jobs at Texas Instruments in United States, Dallas
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Company (1)
Job type
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Job title (1)
United States
State
Dallas
18 jobs found
21.08.2025
TI
Texas Instruments Packaging Engineer United States, Texas, Dallas
Develop new requirements for Flip Chip CSP (FCCSP) packaging and bump process development and maintain quality of existing packages for Automotive, Industrial, Aerospace & Defense, Mobile and Enterprise applications. Define...
Define, design, develop and scale to volume production high voltage (200-3300V) packages and high-power modules for the Industrial, Automotive, Renewable and Telecom markets. Understand market trends & end equipment system...
Lead an Analog IC design team with product ownership and responsibility from definition to release to manufacturing. Direct, guide and participate in activities of a research or technical design function...
High voltage and Medium voltage Protection and Control design and planning. High voltage and medium voltage power distribution and substation design (138kV to 15kV & 15kV to 4160V/480V). Greenfield and...
Oversee both DMS and AMS Design Verification teams with execution ownership and responsibility from definition to release to manufacturing. Actively participate in hiring, developing and evaluating personnel to ensure efficient...
Design and optimize high-speed Si photonics modulator and transmit PIC solutions for next-generation datacom products. Work closely with high speed electronics, architecture, systems, and packaging design teams to develop co-designed...
Minimum education: PhD in Electrical Engineering with direct application to RF. Minimum of 10 years of experience in RF design and related areas. Prior experience leading RF design teams. Expert...
Develop new requirements for Flip Chip CSP (FCCSP) packaging and bump process development and maintain quality of existing packages for Automotive, Industrial, Aerospace & Defense, Mobile and Enterprise applications. Define...
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