Field Applications Program New Grad jobs at Texas Instruments in Japan

When you join TI, you will participate in the Career Accelerator Program (CAP), which provides professional and technical training and resources to accelerate your ramp into TI and set you up for long-term career success. Within this program, we also offer function-specific technical training and on-the-job learning opportunities that will encourage you to solve problems through a variety of hands-on, meaningful experiences from your very first day on the job.

This 12-month experience aims to establish rising Field Applications Engineers (FAEs) as technical TI experts with customer engineers and internal teams. The track includes two 6-month rotations*:

Upon successful completion of the Field Applications Engineer track, participants are welcomed as FAEs on TI's Worldwide Sales & Applications team. FAE responsibilities include:

• Using various sales tools and relationships with design engineering to identify all potential projects
• Providing customers with proactive proposals for complete, system-level solutions that maximize TI content
• Using broad technical expertise to influence customers' part selection process while favorably positioning TI versus competition

Minimum requirements:

• Bachelors degree in Electrical Engineering, Electronics Technology, Electrical Engineering Technology, Electrical and Computer Engineering or related field
• Fluent in local language and English, both written and oral communication skills
• Basic understanding of schematics, layouts and digital components
• Knowledge and understanding of analog circuitry (examples include: op-amps, DC/DC power, data converters, sensing, etc.)
• Experience with lab equipment, like oscilloscopes, along with soldering and debugging skills

Preferred qualifications:

• Experience with lab equipment such as oscilloscopes, along with soldering and debugging skills
• Programming skills in C/C++ (LabView recommended)
• Demonstrated strong analytical and problem solving skills
• Excellent communication and presentation skills
• Ability to work in teams and collaborate effectively with people in different functions
• Strong time management skills that enable on-time project delivery
• Ability to build lasting, influential relationships, both inside and outside the organization
• Ability to work effectively in a fast-paced and ever-changing environment
• Ability to take initiative and drive for results
• Ability to influence decisions through a sense of urgency and competitive drive

About the Job

A brand marketing professional who is responsible for the handling and management of brand marketing operations and channel for TI Japan with below area of responsibilities:

• Brand Marketing Operations & Channel: S/he will work closely with Rest of Asia* Brand Marketing Operations and Channel Manager and Japan Brand Marketing Manager to define, create and execute brand marketing programs in Japan that promotes TI’s focus areas and further drives local business growth.

*Japan, Korea, Taiwan and South Asia

Responsibilities include:

• Channel Management: Collaborate with cross-functional teams, including search, paid media, social, email, programmatic, video teams and local agencies to develop tailored solutions that build stronger brand preference. Responsibilities include, but are not limited to strategy development, tactic execution, audience segmentation, and ads creative management.
• Channel Optimizations and Data Analysis: Collaborate with the Rest of Asia Brand Marketing Operations and Channel Manager to analyze channel performance metrics as well as market trends to identify growth opportunities and make data-driven decisions to optimize brand marketing campaigns. These campaigns aim to achieve specific marketing objectives, such as increasing brand awareness, generating leads, or driving TI.com activities.
• Webinars and Events: Coordinate TI-owned events (i.e. in-person seminars, webinars, Tech Day, Tradeshow), including, but not limited to promotion strategy, customer experience mapping, branding at the events, agency management, speaker management, registration related settings, event reporting, analysis and optimization.
• Platform and Process Management: Agile adoption and swift proficiency in TI tools and platforms. Streamline processes, workflows, and key documents in the team to maximize efficiencies and effectiveness in campaign execution.

Role requirements:

• 1 – 5 years of relevant experience in digital marketing, event marketing, paid and organic channels, data analytics.
• Fluent in written and spoken English and Japanese. Fluency in Korean or Chinese is a plus
• Excellent time-management and project management skills to simultaneously drive on-time execution of multiple projects.
• Ability to prioritize action plans and work through ambiguity.
• Clear, concise communication skills, both verbal and written in both English and Japanese.
• Proactive and positive attitude with strong collaboration skills and team-focused and results-oriented mindset.
• Ability to solve difficult problems with creative solutions.

Preferred qualifications & experience:

• Knowledge of the high-tech or semiconductor industries are preferred, but not required
• Experience with digital marketing paid and organic channels and event management.
• Proficiency in utilizing AI tools and technologies to enhance productivity and streamline workflows.

Packaging engineers play an important role at TI which encompasses the following responsibilities:

• Partner with the businesses to design and develop internal and external solutions for semiconductor packaging technologies, including Wirebond, Flip Chip, Modules, SIPs and other advanced packages at different stages of readiness
• Participate in cross-functional teams, supporting product qualification and production, helping to meet reliability and yield requirements, design testability, and test coverage
• Direct design-of-experiments and work with material suppliers to downselect innovative packaging materials to enhance the reliability and performance of advanced packages.
• Conduct electrical, mechanical, thermal models to comprehend silicon-to-package interaction, establish design rules, and to predict and prevent the use of high risk designs.

Minimum Requirements:

• Student whowill graduate in 2025 or 2026 or graduated in 2024 or 2025
• Bachelors degree in Material Science, Mechanical Engineering, Chemical Engineering, Polymer Science or Physics, Electrical Engineering
• Fluent in Japanese
• Communication skill

Preferred Qualifications:

• Master degree
• Study about inductor, coil, magnetics and motor. Simulation experience with Ansys or original model.

【アナログ FAE 担当領域】アナログ製品(アンプ、AD/DAコンバーター、通信IC、電源IC、ドライバIC、クロック、インターフェース等)を担当【デジタル FAE 担当領域】・デジタル製品(マイコンやプロセッサ、及び無線通信用ICといったソフトウェアを組み込んで動作させるIC等)を担当【入社一年目にUS本社研修あり】技術営業部に入社する新卒入社向けFAST (Field Applications & Sales Training) トレーニングプログラムを実施します。技術的なスキルとビジネスの視点を組み合わせた、セールスのキャリア向けに作られたプログラムとなっています。そのプログラムを通じて、TI のビジネス成長に貢献し、TI でのキャリアを通じて活躍できるような経験を得ることができます。

【募集条件】・理工系学部卒以上・TOEIC600 点以上程度の英語力がある方、日本語ビジネスレベル以上【アナログ FAE 担当領域】・電気/電子回路の基礎知識と簡単なICを使った回路作成経験がある方【デジタル FAE 担当領域】・C言語を用いたプログラミング経験と、汎用/リアルタイムOSの使用経験(PCにLinuxをインストールし活用したなど)。

When you join TI, you will participate in the Career Accelerator Program (CAP), which provides professional and technical training and resources to accelerate your ramp into TI and set you up for long-term career success. Within this program, we also offer function-specific technical training and on-the-job learning opportunities that will encourage you to solve problems through a variety of hands-on, meaningful experiences from your very first day on the job.

This 7-month experience aims to teach Technical Sales Associates (TSAs) how to build and manage customer relationships, and how to influence decisions to grow TI's revenue. The track includes three rotations*:

Upon successful completion of this track in the FAST program, participants are welcomed as Technical Sales Representatives (TSRs) on TI's Worldwide Sales& Applications team. Technical Sales Representative responsibilities include:

• Using technical expertise, various sales tools and relationships with engineering teams to identify projects
• Managing and quantifying leads, and managing the commercial aspects of customer relationships
• Developing, forecasting and monitoring an annual plan for revenue growth

Minimum requirements:

• Student who will graduate in 2026
• Bachelors degree in Electrical Engineering, Computer Engineering, Electrical and Computer Engineering or related field
• Fluent in local language and English, both written and oral communication skills

Preferred qualifications:

• Ability to establish strong relationships with key stakeholders critical to success, both internally and externally
• Strong verbal and written communication skills
• Ability to quickly ramp on new systems and processes
• Demonstrated strong interpersonal, analytical and problem-solving skills
• Ability to work in teams and collaborate effectively with people in different functions
• Ability to take the initiative and drive for results
• Strong time management skills that enable on-time project delivery

In this role, your responsibilities include:

• Help TI secure customer commitments and win business by working on-site with customers in support of their engineering teams developing applications
• Recommend and implement system processor solutions to customers in a consultative role have strong embedded software development skills
• Develop custom applications and example code for key customers
• Debug software components in the customers end systems
• Work closely with the sales team and product group to capture processor business and successfully take it to revenue
• Take customer designs to revenue by providing prompt and thorough support for on-going design activity
• Understand the competitive landscape; constantly applying lessons from customer engagement to refine this competitive understanding
• Use competitive knowledge to tailor feedback to the product group for new product/feature development
• Understand the specific business benefits that such feature/product enhancements will produce
• Define and develop software and systems application notes and collateral for the above mentioned devices
• Present at TI technical conferences and facilitate product specific customer trainings (seminars/workshops)

Minimum requirements:

• Bachelor's degree in EE/Comp Eng, or comparable
• Minimum 5 years of relevant experience
• Working understanding of applications with an emphasis on PC motherboard controllers and system management controllers
• Fluent in Japanese and English

Preferred qualifications:

• Strong verbal and written communication skills
• Strong presentation skills, with ability to effectively relate materials to customers
• Demonstrated strong analytical and problem solving skills
• Ability to work in teams and collaborate effectively with people in different functions
• Ability to take the initiative and drive for results
• Strong time management skills that enable on-time project delivery
• Ability to work effectively in an interrupt-driven, fast-paced and rapidly changing environment
• Demonstrated ability to build strong, influential relationships
• Ability to efficiently context-switch between multiple concurrent tasks
• Ability to advocate for customer needs (with an understanding of “why”) back into the TI product groups

Packaging engineers play an important role at TI which encompasses the following responsibilities:

• Partner with the businesses to design and develop internal and external solutions for semiconductor packaging technologies, including Wirebond, Flip Chip, Modules, SIPs and other advanced packages at different stages of readiness
• Participate in cross-functional teams, supporting product qualification and production, helping to meet reliability and yield requirements, design testability, and test coverage
• Direct design-of-experiments and work with material suppliers to downselect innovative packaging materials to enhance the reliability and performance of advanced packages.
• Conduct electrical, mechanical, thermal models to comprehend silicon-to-package interaction, establish design rules, and to predict and prevent the use of high risk designs.

Minimum Requirements:

• Bachelors degree in Material Science, Mechanical Engineering, Chemical Engineering, Polymer Science or Physics, Electrical Engineering
• Cumulative 3.0/4.0 GPA, or higher

Preferred Qualifications:

• Basic understanding of statistical process control (SPC)
• Semiconductor packaging knowledge is preferred (manufacturing processes, assembly, reliability, materials, characterization, FA)
• Demonstrated analytical and problem solving skills
• Strong written and verbal communication skills
• Ability to work in teams and collaborate effectively with people in different functions
• Strong time management skills that enable on-time project delivery
• Ability to build strong, influential relationships
• Ability to work effectively in a fast-paced and rapidly changing environment
• Ability to take the initiative and drive for results