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Ic Packaging Engineer jobs at Microsoft in Malaysia

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22 jobs found
16.07.2024
M

Microsoft IC Packaging Engineer Malaysia, Penang

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Description:
5+ years of related technical engineering experienceOR Bachelor's degree in Electrical Engineering, Mechanical Engineering, Materials Engineering, Chemical Engineering, or related field AND 5+ years technical engineering experience or internship experience.OR...
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15.07.2024
M

Microsoft Senior IC Failure Analysis Fault Isolation Engineer Malaysia, Penang

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Description:
10+ years of experience in product and test engineering, specializing in ATE test program development. 8+ years of experience in developing integrated circuits (pre-silicon, first silicon bring-up, new product introduction)....
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16.09.2024
M

Microsoft Product Quality Reliability Engineer Malaysia, Penang

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Description:
7+ years of experience in product and test engineering, specializing in ATE test program development. 5+ years of experience in developing integrated circuits (pre-silicon, first silicon bring-up, new product introduction)....
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09.09.2024
M

Microsoft Principal Product Test Engineer Malaysia, Penang

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Description:
15+ years of experience in developing integrated circuits (pre-silicon, first silicon bring-up, new product introduction) tools, flows, solution and methodology across design and test domain with strong software implementation experience....
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09.09.2024
M

Microsoft Senior Physical Design Engineer Malaysia, Penang

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Description:
7+ years of related technical engineering experienceOR Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 4+ years technical engineering experience or internship experienceOR Master's degree...
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10.09.2024
M

Microsoft Support Engineer - Azure Databricks Big Data Malaysia, Selangor, Sepang

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Description:
OR 5+ years of technical support, technical consulting experience, or information technology experience. OR equivalent experience. Experienced in one of coding skills, for example Python, Java, Scala or R. Experienced...
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16.07.2024
M

Microsoft Product Engineer Malaysia, Penang

Limitless High-tech career opportunities - Expoint
Description:
7+ years of experience in product and test engineering, specialize in ATE test program development. 5+ years of experience in developing integrated circuits (pre-silicon, first silicon bring-up, new product introduction)....
Full job details
Limitless High-tech career opportunities - Expoint
Description:
5+ years of related technical engineering experienceOR Bachelor's degree in Electrical Engineering, Mechanical Engineering, Materials Engineering, Chemical Engineering, or related field AND 5+ years technical engineering experience or internship experience.OR...
Full job details
Find your dream job in the high tech industry with Expoint. With our platform you can easily search for Ic Packaging Engineer opportunities at Microsoft in Malaysia. Whether you're seeking a new challenge or looking to work with a specific organization in a specific role, Expoint makes it easy to find your perfect job match. Connect with top companies in your desired area and advance your career in the high tech field. Sign up today and take the next step in your career journey with Expoint.