Graduate Talent Cpu-soc Silicon Design jobs at Intel in Malaysia

Job Description:

• Translates product requirements into package architecture specification, drives end-to-end package solutions for physical, electrical, and cost requirements.
• Leads technology tradeoff decisions ensuring silicon packages conform to electrical, mechanical, thermal, and reliability standards, specifications, and landing zones.
• Collaborates with silicon, hardware, and package leads to ensure high quality package output and aids in removing roadblocks.
• Oversees end-to-end package development process, including design, processes, and procedures and continuously improves packaging quality standards and targets.
• Applies expertise in package design troubleshooting, resolves new and existing packaging problems involving designs, materials, and processes and provides innovative and cost-effective solutions.
• Collaborates with manufacturing team to ensure the packaging design and tape-out seamlessly transition to production.

Qualifications:

• Bachelor Degree in relevant engineering/science domain with minimum 10 years of experience in the package design and/or architecture.
• Prior leadership role in package technology readiness development, design tape-out and/or innovation.

Experienced HireShift 1 (India)India, BangaloreMalaysia, Penang

Job Description:

• Translates product requirements into package architecture specification, drives end-to-end package solutions for physical, electrical, and cost requirements.
• Leads technology tradeoff decisions ensuring silicon packages conform to electrical, mechanical, thermal, and reliability standards, specifications, and landing zones.
• Collaborates with silicon, hardware, and package leads to ensure high quality package output and aids in removing roadblocks.
• Oversees end-to-end package development process, including design, processes, and procedures and continuously improves packaging quality standards and targets.
• Applies expertise in package design troubleshooting, resolves new and existing packaging problems involving designs, materials, and processes and provides innovative and cost-effective solutions.
• Collaborates with manufacturing team to ensure the packaging design and tape-out seamlessly transition to production.

Qualifications:

• Bachelor Degree in relevant engineering/science domain with minimum 10 years of experience in the package design and/or architecture.
• Prior leadership role in package technology readiness development, design tape-out and/or innovation.

Experienced HireShift 1 (Malaysia)Malaysia, Penang

-Develops pre-silicon functional validation strategy, test plan, test suite, test methodologies for state-of-the-art SoC/chipset.-Collaborates with architects, micro-architects, design and system validation teams for IP/SoC validation strategy, technical readiness and failure disposition.-Performs low level and complex debug for multiple systems, subsystems within a product, or at the IP/SoC level for Intel products. -Applies deep understanding of IP/SoC design, architecture, firmware, and software to resolve triage failures, marginality issues, and conduct root cause analysis.-Defines, develops, and implements techniques for faster debug at the IP/SoC and platform level and isolates failing components of a system.-Graduates from Bachelor / Master's degree in Electrical and/or Electronic Engineering, Computer or Microelectronic Engineering . -Knowledge on Computer System Architecture and/or related software-hardware sub-systems.-Knowledge on software programming in Python, Maestro/Perspec, C and/or C++ language and UNIX, automate verification flow and improve efficiency.Shift 1 (Malaysia)Malaysia, Penang

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

-Develops pre-silicon functional validation strategy, test plan, test suite, test methodologies for state-of-the-art SoC/chipset.-Collaborates with architects, micro-architects, design and system validation teams for IP/SoC validation strategy, technical readiness and failure disposition.-Performs low level and complex debug for multiple systems, subsystems within a product, or at the IP/SoC level for Intel products. -Applies deep understanding of IP/SoC design, architecture, firmware, and software to resolve triage failures, marginality issues, and conduct root cause analysis.-Defines, develops, and implements techniques for faster debug at the IP/SoC and platform level and isolates failing components of a system.-Graduates from Bachelor/Master's degree in Electrical and/or Electronic Engineering, Computer or Microelectronic Engineering. -Knowledge on Computer System Architecture and/or related software-hardware sub-systems.-Knowledge on software programming in Python, Maestro/Perspec, C and/or C++ language and UNIX, automate verification flow and improve efficiency.Shift 1 (Malaysia)Malaysia, Penang

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

Develops pre-silicon functional validation test suites to validate system will meet design requirements and delivering state-of-the-art chipsets/SoC validation on the next generation design.
Creates test plans, defining, executing and debugging on system emulation models, and finding and implementing corrective measures for failing test.- Bachelor/Masters in Computer/Electronic Engineering
- Knowledge on Computer System Architecture and/or related software-hardware sub-systems.
- Experience with software programming in Python, C and/or C++ language.
- Experience ondebug, or RTL validation is a plus.- Highly motivated, curious, and keenly interested in finding and resolving technical anomaliesShift 1 (Malaysia)Malaysia, KulimMalaysia, Penang

In this position, you will be performing Failure Analysis and root cause analysis on Intel CPU, Chipsets and Netcomm platform products. This includes PC system and/or tester testing and analysis to isolate the failing instruction and internal signal, applying circuit analysis and various device localization equipment and techniques to localize the failing circuitries and performing physical failure analysis to locate the defect.Your responsibilities will include but not be limited to1. Responsible for improving product yield, quality and reliability through the recommendation of corrective actions to counterparts in Fab and Assembly and Test for root cause fix.2. Participating in new product and/or technology transfer and startup, enabling automation and improvement on the failure analysis process, tools and methodology, developing new FA techniques and proliferating learning across sites.You must possess a Master's or a Bachelor's degree in Electrical, Electronics, or Microelectronics. Additional qualifications include1. Excellent verbal and written communication skills2. Ability to work well in a diverse team environment, excellent teamwork and a positive mindset3. Strong problem solving and analytical skills4. Good knowledge in one or more of these areas:a) Device physics, I/O structure,b) Microprocessor architecture and micro architecture, microprocessor circuit, circuit analysis and IA-32c) Perl/Python/C programming/Assembly languaged) Wafer fabrication process (added advantage)Shift 1 (Malaysia)Malaysia, Penang

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

Job Description:

• Performs Pre-Silicon functional verification of CPU logic to ensure design will meet specification requirements.

• Develops IP verification plans, test benches, and the verification environment to ensure coverage to confirm to CPU microarchitecture specifications.

• Executes verification plans and defines and runs system simulation models to verify the design and uncover bugs.

• Replicates, root causes, and debugs issues in the Pre-silicon environment.

• Finds and implements corrective measures to resolve failing tests.

• Collaborates with CPU architects/RTL developers to improve verification of complex architectural and microarchitectural features and to meet functional, performance, and power goals.

• Documents test plans and drives technical reviews of plans and proofs with design and architecture teams.

• Maintains and improves existing functional verification infrastructure and methodology.

Qualifications:

• Bachelor's or Master's degree in Electrical or Electronics Engineering, Computer Engineering, or any related field.

• Good knowledge in CPU architecture and Computer System.

• Experience with System Verilog and UVM.

• Experience with scripting (i.e PERL, Phyton).

• Familiar with verification tools and methodologies.

• Excellent problem-solving and debugging skills.

• Effective communication and collaboration abilities.

• Self-motivated and able to work effectively in a dynamic, fast-paced environment.

Experienced HireShift 1 (Malaysia)Malaysia, Penang

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.