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Fe Device Lab + Package Level Engineer jobs at Intel in Malaysia
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178 jobs found
Today
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Intel Module Engineer Malaysia, Kedah
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Owns critical high volume manufacturing equipment and processes that enable rapid device miniaturization and the mass production of integrated circuits. Conducts tests and measurements of their operations to ensure control...
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Yesterday
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Intel Process & Equipment Engineer Malaysia, Kedah
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Owns critical high volume manufacturing equipment and processes that enable rapid device miniaturization and the mass production of integrated circuits. Conducts tests and measurements of their operations to ensure control...
Yesterday
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Intel Module Engineer Malaysia, Penang
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Owns critical high volume manufacturing equipment and processes that enable rapid device miniaturization and the mass production of integrated circuits. Conducts tests and measurements of their operations to ensure control...
Yesterday
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Intel Test Module Engineer Malaysia, Kedah
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Owns critical high volume manufacturing equipment and processes that enable rapid device miniaturization and the mass production of integrated circuits. Conducts tests and measurements of their operations to ensure control...
12.08.2025
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Intel Graduate Talent ISCP SV Design Verification Engineer Malaysia, Penang
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Develops pre-silicon functional validation strategy, test plan, test suite, test methodologies for state-of-the-art SoC/chipset. Collaborates with architects, micro-architects, design and system validation teams for SoC validation strategy, technical readiness and...
11.08.2025
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Intel Assembly Handling Systems Development Engineer Malaysia, Kedah
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Responsible for developing material handling technology involving high accuracy and high-speed pick-n-place systems for next-generation semiconductor packaging technology. Responsibilities include development of handling process recipes, design/validation of nozzle tooling, and...
11.08.2025
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Intel Graduate Talent Emulation/FPGA Prototyping Engineer Malaysia, Penang
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Builds emulation and FPGA models and solutions from RTL design using synthesis, partitioning, and routing tools. Develops, integrates, tests, and debugs hardware and software collateral in simulation, emulation, and FPGA...
Description:Full job details
Owns critical high volume manufacturing equipment and processes that enable rapid device miniaturization and the mass production of integrated circuits. Conducts tests and measurements of their operations to ensure control...
These jobs might be a good fit
Find your dream job in the high tech industry with Expoint. With our platform you can easily search for Fe Device Lab + Package Level Engineer opportunities at Intel in Malaysia. Whether you're seeking a new challenge or looking to work with a specific organization in a specific role, Expoint makes it easy to find your perfect job match. Connect with top companies in your desired area and advance your career in the high tech field. Sign up today and take the next step in your career journey with Expoint.