Ibm Z Systems Hardware Architect jobs at Ibm in United States, City Of Poughkeepsie
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City Of Poughkeepsie
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IBM
IBM Research Hardware Developer Advisory professional United States, New York, City of Albany
Required Technical and Professional Expertise1) More than 5 years experience with 3D flip chip assembly, reliability testing, and failure analysis,2) Basic understanding of wafer level packaging/assembly processes, laminate, reliability test,...
Required Technical and Professional Expertise1) More than 8 years experience with 3D flip chip assembly, reliability testing, and failure analysis,2) Basic understanding of wafer level packaging/assembly processes, laminate, reliability test,...
Your Role and The job role is thermal hardware developer, responsibilities include creating thermal simulations of electronic assemblies, lab experiments to test concept, prototype, and finished assemblies, presenting results of...
Preferred Technical and Professional Expertise1) Hands on experience in semiconductor 3D packaging technology,2) Experience of flip chip assembly process (TCB, reflow), laminate technology, packaging reliability test, failure analysis, and semiconductor...
Willingness to complete the requirements of the apprenticeship program. Some knowledge or experience in ONE or more of the following:Java, JavaScript, PHP, C#, Objective-C, C/C++, Python, Ruby and/or functional languages...
Have experience in Customer Service & Customer Interaction. Have basic computer knowledge (e.g., knows what a hard drive, RAM, memory DIMM, IP address). Can demonstrate mechanical aptitude, and given the...
6+ years of software development experience. Experience leading others on development projects. Experience in product development, support, and customization based on business requirements. Proficient in C/C++ programming langauge. Strong analytical,...
Required Technical and Professional Expertise1) More than 5 years experience with 3D flip chip assembly, reliability testing, and failure analysis,2) Basic understanding of wafer level packaging/assembly processes, laminate, reliability test,...
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