R&d Process Engineer Etch Packaging jobs at Applied Materials in Singapore, Singapore

Key Responsibilities

• Responsible for all technical support related aspects at a specific customer: escalations, fleet performance, system installations, improvement programs and upgrades.

• Acts as intermediary and field escalation focal point between customer and Division by providing technical support and documentation to field engineers, technicians and product support personnel who are diagnosing, troubleshooting, repairing and debugging equipment.

• Provides Alpha Site support to Engineering specifically related to installation, operation, calibration, service and /or testing of a new hardware, process or software design in house or on an engineering tool

• Provides Beta Site Support; specifically related to installation, operation, calibration, service and/or testing of a new hardware, software or processes on a customer tool.

• Initiates and provides review of ECO's to ensure data supports fix and follow up with communication to the field.

• Generates and presents system performance data as required. This includes performance metrics such as MTBF, MTBI and Availability. Reporting will also include process data and I/W spending analysis.

• Supports GPS in the generation of documentation such as CENs and BKMs. Creates and reviews documentation covering technical improvements, system upgrades, and support plans. Presents at customer level. Ensures field implementation.

Requirements

• Prior hands-on experiences in Wafer Fabrication Semiconductor tools (CVD, PVD, Etch)

• Relevant education qualification in Engineering

• Ability to work with deadlines and with all levels of internal and external stakeholders including customers

• Ability to work in cleanroom work environment

Work Location

• Science Park II (Moving to Tampines in end 2026)

Key Responsibilities

• Identify and troubleshoot a variety of difficult mechanical problems with limited supervision

• Define, coordinate, perform and document engineering test reports

• Develop, design, or modify mechanical engineering layouts, schematics, ordrawings/specificationsof difficult scope

• Perform engineering analysis of difficult scope with limited supervision

• Technically lead or execute projects; develop key suppliers and generate mechanical product specifications

• Design, develop and implement custom mechanical tooling, fixturing and associated processes; enable the handling, assembly and/or disassembly of parts, components, sub-assemblies, and final assemblies; establish standards across all operational processes

• Specify and review engineering documentation

• Implement concepts for a variety of complex product issues and mechanical solutions

• Clearly communicate complex or sensitive information; build consensus

Requirements

• PhD/ Master/ Bachelor’s degree in Electrical or Mechanical Engineering

• More than 5 years of relevant experiences in semiconductor equipment design or troubleshooting experiences

• Proficient in simulation and analysis methods (FEA, thermal analysis and tolerance analysis)

• Strong in the following fields: Thermal, Compressible flow, Engineering Design, Machining & manufacturing processes

• Ability to craft clear engineering documentation

• Ability to form effective cross-functional relationships and to communicate product design/mechanical requirements clearly to non-experts

• Excellent verbal and written communication skills and the ability to interact professionally with a diverse group of internal and external stakeholders

• Self-starting individual, proactive and resourceful

Work Location:

• Science Park II (Moving to Tampines in end 2026)

Key Responsibilities

Enable Next-Gen Solutions Through Direct Engagement:

• Act as the technical owner for PVD solutions at assigned OSATs and Fabless accounts, ensuring alignment between design requirements and manufacturing processes.

• Understand Customers and Fabless stakes holders technical roadmap.

• Partner with Fabless packaging architects to define material stacks, reliability criteria, and integration flows; translate these into executable solutions for OSATs.

• Lead joint qualification programs involving Fabless and OSAT stakeholders: define success metrics, DoEs, and acceptance gates; manage execution to schedule.

Process Qualification & Ramp:

• Establish process-of-record (POR) for advanced packaging applications (e.g., RDL barrier/seed, TSV liners, hybrid bonding underlayers).

• Drive tool acceptance (FAT/SAT) and HVM ramp at OSAT sites: SPC setup, chamber matching, defectivity control, and yield stabilization.

• Validate PVD film integrity under Fabless-driven reliability tests (JEDEC/IPC standards: EM, TDDB, thermal cycling).

Cross-Functional Collaboration:

• Coordinate with Applied Materials’ Product Engineering, Field Service, and Quality teams to deliver robust solutions tailored to OSAT and Fabless needs.

• Resolve integration challenges across packaging flows (e.g., ESD, adhesion, contamination, stress) through structured problem-solving.

Continuous Improvement:

• Lead structured root cause analysis on yield/reliability excursions; implement corrective actions and verify effectiveness.

• Provide feedback to internal engineering for hardware and process enhancements based on OSAT and Fabless requirements.

Required Qualifications

• Bachelor’s or Master’s in Materials Science, Physics, Chemical Engineering, or related field; PhD preferred.

• 10+ years in semiconductor equipment/process engineering with strong PVD experience in Advanced Packaging (FO-WLP, 2.5D/3D, RDL/UBM).

• Proven success enabling solutions through direct engagement with OSATs and Fabless design houses.

Preferred Qualifications

• Experience enabling hybrid bonding or chiplet integration through PVD underlayers.

• Familiarity with APAC OSAT ecosystem and Fabless packaging roadmaps.

• Proficiency in SPC, DOE, metrology, and yield analytics.

• Expertise in thin-film metallurgy (Cu, Ni, Ti, Ta/TaN, Co) and reliability-critical stack design.

• Strong communication skills to engage executive Fabless stakeholders and OSAT engineering teams.

Work Location

• Science Park II (Moving to Tampines in end 2026)

Advanced Packaging Process Development

• Define and implement process flows for panel-level packaging and other advanced panel technologies.

• Drive material selection and compatibility studies for large-format form factors.

• Keeps abreast of new developments in own and related technology groups. Participates in publishing in ET conferences and journals.

• Develop innovative solutions as part of proven track record of significant technology contributions. Recognized internally (across Business Units) as one of the limited number of technical experts in their field of expertise

• Conceive and implement new technology, normally named as primary inventor on numerous critical patents and recognized through awards and/or published papers within the last five years.

• Leads and collaborates to contribute to the development of new principles and concepts. Guides less experienced engineers in utilizing techniques to define methods and new technologies and apply them on unusually complex systems. Involved in judging the approach and verifying the validity of technical strategies.

Functional Knowledge

• Optimize thin film deposition techniques such as Physical Vapor Deposition (PVD), Chemical Vapor Deposition (CVD) (Including PECVD for low-temperature applications), Atomic Layer Deposition (ALD) for atomic-scale control and high-k dielectrics.

• Electrochemical Deposition (ECD): For metal layers in advanced packaging.

Cross-Functional Collaboration

• Works with business unit in technology development and transfer to customers including customized process development. Plans unit process sequence based on customer requirements. Negotiates process specifications and service offerings with customers. Takes ownership of delivering the required solution to the customers that meets specification.

• Serves as the customer expert across a broad range of products. Plays a key role in defining product strategy and identifying gaps. Provides feedback to business unit heads on process and hardware improvements to meet customer roadmap requirements.

• Work closely with design, reliability, and materials teams to ensure manufacturability and performance.

• Support technology transfer from development to high-volume manufacturing.

• Provides oversight of customer demos, including defining demo conditions and analyzing results.

Data Analysis and Continuous Improvement

• Analyze process data for trend identification and optimization.

• Drive continuous improvement initiatives for unit level process and cycle time improvement.

• Conduct root cause analysis for defects and implement corrective actions to improve yield and reliability.

• Within safety guidelines design, perform, collect data, analyze and compile reports on unusually complex engineering experiments and provides solutions which are highly innovative and ingenious.

Requirements

• Bachelor’s degree with 15 years of experience, Master’s degree with 10 years or PhD degree with 5 years of experience in Electrical Engineering, Materials Science, Chemical Engineering, or related field.

• Expertise in thin film deposition techniques and dielectric etch and panel packaging process integration .

• Experience with advanced packaging technologies such as fan-out panel-level packaging (FOPLP), substrate technology and wafer Back-end technology.

• Knowledge of industry standards and best practices in semiconductor packaging.

• Strong understanding of semiconductor packaging technologies and process flows.

• Strong knowledge of process characterization and troubleshooting.

• Excellent problem-solving skills and ability to work in a fast-paced environment.

• Ability to work in a cleanroom environment

• Excellent communication skills

Work Location

• Science Park II (Moving to Tampines in end 2026)

Key Responsibilities

• Creates and monitors metrics to better understand discrepant material trends.

• Investigates data trends for actions and projects to reduce manufacturing generated discrepant material and scrap.

• Assign discrepant material reduction tasks and projects to personnel outside the Quality organization and track assignments to completion.

• Facilitate meetings to receive updates on tasks and projects.

• Provide training as necessary to Operations personnel.

• In a few cases, may need to develop and implement operational sequence and processes in the fabrication of parts, components, sub-assemblies, and final assemblies and lead manufacturing engineering related projects as required.

• Interfaces with other engineering functions to ensure new product has implemented changes which mitigate the risk of discrepant material being generated.

• Determines root cause analysis for issues that arise during assembly and/or test of systems; drives correction actions; provides failure analysis report as required.

• Uses lean six sigma methodology to drive continuous improvement projects.

• Collaborate with Supplier Quality Engineers to minimize supplier caused Quality non-conformances

  • Quick engagement with Supplier Quality Engineers to manage responsiveness of suppliers to Mfg. issues with a focus on keeping manufacturing operational.

  • Engagement on stock purges or containments in manufacturing while working with the Manufacturing Engineers to assess the product and prevent a line down

  • Follow up with Supplier Quality Engineers and keep Manufacturing abreast of progress

• Evaluates work methods, procedures, and policies. Develops and maintains new business processes; edits as necessary to ensure current practices are documented.

Requirements

• Bachelor's Degree in Engineering, Science or other relevant qualifications.

• At least 3 years of quality engineering experiences preferably in manufacturing or semiconductor industry

• Professional qualifications in Quality will be an added advantage.

• Proficiency in quality analysis tools and statistical software (e.g., Minitab).

• Familiarity with Lean Manufacturing and Six Sigma principles (Green Belt preferred).

• Excellent problem-solving, analytical, and communication skills.

• Ability to work cross-functionally and manage multiple projects in a fast-paced environment across different time zones.

Work Location

• Upper Changi

Key Responsibilities:

• Performs all standard service activities through Tier I unassisted. Performs standard Tier II with assistance. Able to perform routine preventative maintenance within established timeframes. Completes quality repairs.
• Responds to fab issues by communicating with other engineers and participating in escalation conference calls. Verifies operational quality of system equipment unassisted . Assists senior engineers as needed.
• Follows all checklists and procedures and ensures correct Revs of procedures and schematics are available prior to performing work.
• Strives to perform BKM’s. Uses knowledge management systems. Follows all IP guidelines.
• Able to diagnose and resolve recurring technical problem. Demonstrates consistent ability to execute escalation plan. Able to resolve Day-Day issues. Exposure to systemic issue resolution. Able to support the preparation and delivery of technical issues to internal and external stakeholders. Knowledge in fundamental theories. Minimum aid needed to read circuit diagrams. Single primary product and platform. Executes projects to reduce costs and increase uptime.
• Applies diagnostic techniques and use of documentation and test equipment with assistance from senior engineers (Testing). Has the ability to diagnose and resolve technical problems (Corrective maintenance). Uses training and experience to identify some process, software or hardware related system problems (Predictive maintains).
• Assumes responsibility for complete customer satisfaction within work area. Assists in planning, communicating, and coordinating support plans with customer management. Complies with all safety procedures and consistently demonstrates safety as a value.

Other Requirements:This is a physically demanding position that often requires extensive walking, standing for extended periods of time, working in tight spaces, bending, squatting, twisting, kneeling, reaching, climbing stairs and ladders, lifting up to 35 lbs., the ability to distinguish between colors, the ability to work in an environment with noise that may be difficult for some individuals with sensitivity to noise, and the use of hand and powertools. Additionally,because this position generally involves working in a clean room, it requires the use of appropriate Personal Protective Equipment such as coveralls, hoods, booties, safety glasses, gloves, respirators, chemical aprons, and face shields.

Functional Knowledge:

• Has established skills to perform a range of day-to-day activities.

Business Expertise:

• Understands how the assigned duties relate to others in the team and how the team integrates with others in the discipline.
• Assumes responsibility for full customer satisfaction assuring excellent relations within assigned area.

Leadership:

• Has no supervisory responsibilities; manages own workload.

Problem Solving:

• Recognizes and solves typical problems that can occur in own work area without supervisory approval; evaluates and selects solutions from established options.

Impact:

• Impacts own team through the quality of the services or information provided; follows standardized procedures and practices and receives regular but moderate supervision and guidance.

Interpersonal Skills:

• Uses communication skills to exchange information.