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Ic Packaging Simulation Engineer jobs at Apple in United States, Cupertino
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Cupertino
1,460 jobs found
06.06.2024
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Apple IC Packaging Simulation Engineer United States, California, Cupertino
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Description:Full job details
Proven capability in mechanics and mathematics. Hands-on experience of major FEM tools (e.g., ANSYS, ABAQUS, Hypermesh, etc.). Proficiency with numerical simulation software tools and expert in Matlab and/or Scientific Python....
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05.06.2024
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Apple IC Packaging Simulation Engineer United States, California, Cupertino
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Description:Full job details
Proven capability in mechanics and mathematics. Hands-on experience of major FEM tools (e.g., ANSYS, ABAQUS, Hypermesh, etc.). Proficiency with numerical simulation software tools and expert in Matlab and/or Scientific Python....
31.05.2024
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Apple IC Packaging Integration Engineer United States, California, Cupertino
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We are looking for someone experienced in the semiconductor packaging and/or system integration. Good understanding of multi-functional packaging areas: package layout and architecture, enabling process technologies, thermal, mechanical, SI/PI, material,...
31.05.2024
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Apple IC Packaging Characterization Engineer United States, California, Cupertino
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Proficiency with major mechanical design CAD tools, such as Siemens NX, AutoCAD, SpaceClaim, SolidWorks, etc. Proven capability of setting up equipment and data acquisition systems. Hands-on experience of major material...
12.06.2024
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Apple IC Packaging Integration Engineer United States, California, Cupertino
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Description:Full job details
We are looking for someone experienced in the semiconductor packaging and/or system integration. Good understanding of multi-functional packaging areas: package layout and architecture, enabling process technologies, thermal, mechanical, SI/PI, material,...
06.06.2024
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Apple NAND Packaging Engineer United States, California, Cupertino
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Experience in the packaging design and assembly process development for stacked-die memory packages. Proven knowledge of wirebond and flip-chip assembly process applied to thin-die stacking. Hands on experience using packaging...
06.06.2024
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Apple DRAM Packaging Engineer United States, California, Cupertino
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5+ years’ experience in memory package architecture and assembly process development for stacked-die packages. Strong knowledge of advanced packaging technology, design rules, SIPI, to architect high-density packages. Strong knowledge of...
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Description:Full job details
Proven capability in mechanics and mathematics. Hands-on experience of major FEM tools (e.g., ANSYS, ABAQUS, Hypermesh, etc.). Proficiency with numerical simulation software tools and expert in Matlab and/or Scientific Python....
These jobs might be a good fit
Find your dream job in the high tech industry with Expoint. With our platform you can easily search for Ic Packaging Simulation Engineer opportunities at Apple in United States, Cupertino. Whether you're seeking a new challenge or looking to work with a specific organization in a specific role, Expoint makes it easy to find your perfect job match. Connect with top companies in your desired area and advance your career in the high tech field. Sign up today and take the next step in your career journey with Expoint.