Ic Package Integration Engineer jobs at Apple in United States, Cupertino
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Company (1)
Job type
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Job title (1)
United States
State
Cupertino
1,464 jobs found
30.05.2024
A
Apple IC Package Integration Engineer United States, California, Cupertino
We are looking for someone with experience in Semiconductor Packaging Design, Process & Technology Development. Good understanding of cross-functional packaging areas: Si floor plan, package layout and architecture, enabling process...
We are looking for someone with experience in Semiconductor Packaging Design, Process & Technology Development. Good understanding of cross-functional packaging areas: Si floor plan, package layout and architecture, enabling process...
We are looking for someone experienced in the semiconductor packaging and/or system integration. Good understanding of multi-functional packaging areas: package layout and architecture, enabling process technologies, thermal, mechanical, SI/PI, material,...
We are looking for someone experienced in the semiconductor packaging and/or system integration. Good understanding of multi-functional packaging areas: package layout and architecture, enabling process technologies, thermal, mechanical, SI/PI, material,...
Proven experience in Battery Management architecture design and circuit development. Experience with the specification and design of ADCs for Li_Ion parametric measurement, coulomb counting and other key parameters of a...
In depth knowledge of semiconductor manufacturing process. Proven understanding of Analog, Mixed-Signal, DC and Power IC fundamentals. Understanding of yield analysis and improvement activities. Experience working with cross-functional teams to...
Proven capability in mechanics and mathematics. Hands-on experience of major FEM tools (e.g., ANSYS, ABAQUS, Hypermesh, etc.). Proficiency with numerical simulation software tools and expert in Matlab and/or Scientific Python....
We are looking for someone with experience in Semiconductor Packaging Design, Process & Technology Development. Good understanding of cross-functional packaging areas: Si floor plan, package layout and architecture, enabling process...
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