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Dram Packaging Engineer jobs at Apple in United States, Cupertino
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Cupertino
1,460 jobs found
06.06.2024
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Apple DRAM Packaging Engineer United States, California, Cupertino
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5+ years’ experience in memory package architecture and assembly process development for stacked-die packages. Strong knowledge of advanced packaging technology, design rules, SIPI, to architect high-density packages. Strong knowledge of...
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25.09.2024
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Apple DRAM Product Engineer United States, California, Cupertino
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Hands-on experience in DRAM development. Knowledge of DRAM cell architectures. Exposure in DRAM memory organization and periphery design for low DRAM power. Expertise in DRAM reliability. Knowledge of innovative packaging...
04.06.2024
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Apple DRAM Design Validation Engineer United States, California, Cupertino
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We are looking for candidates with a minimum of 3 years of experience and the following:. Excellent interpersonal skills and teamwork. Knowledge in DRAM cell architectures. Experience of DRAM memory...
06.06.2024
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Apple NAND Packaging Engineer United States, California, Cupertino
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Experience in the packaging design and assembly process development for stacked-die memory packages. Proven knowledge of wirebond and flip-chip assembly process applied to thin-die stacking. Hands on experience using packaging...
05.06.2024
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Apple NAND Packaging Engineer United States, California, Cupertino
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We are looking for someone with 2+ years’ experience in package design and assembly process development for stacked-die memory packages. Strong knowledge of wirebond and flip-chip assembly process applied to...
13.06.2024
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Apple Packaging Substrate Engineer United States, California, Cupertino
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We are looking for an individual with experience as a process integration, manufacturing, R&D engineer in substrate industry In-depth knowledge of substrate technology. Familiarity with PKG process & criteria is...
24.07.2024
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Apple Senior Packaging Engineer United States, California, Cupertino
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BS with 5+ years of semiconductor packaging/assembly experience. M.S or Ph.D. in Mechanical Engineering, Physics, Materials Science or similar disciplines. Prior optical packaging experience with LED, photodiode and optical component...
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Description:Full job details
5+ years’ experience in memory package architecture and assembly process development for stacked-die packages. Strong knowledge of advanced packaging technology, design rules, SIPI, to architect high-density packages. Strong knowledge of...
These jobs might be a good fit
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