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Npi Opm Operations Program Manager jobs at Apple in China, Shenzhen
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China
Shenzhen
41 jobs found
26.08.2025
A
Apple DFM Engineer- SiP NPI China, Guangdong Province, Shenzhen
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M.S degree in mechanical engineering, physics, materials science or equivalent, with minimum 5 years of experience in IC packaging (for Bachelor, 10 years above experience is required). General knowledge /...
Description:
Apple is where individual imaginations gather together, committing to the values that lead to great work. Every one of us shares a belief that we can make something wonderful and share it with the world, changing lives for the better. You will become part of a hands-on development team that sets the standard in encouraging excellence, creativity and innovation. Here, you’ll do more than join something — you’ll define something.As one of us (SiP process NPI team), you will interface between internal product/device design, quality, supply chain, and the external suppliers to develop and deploy new System-in-Package (SiP) technologies. We are looking for individuals who are innovative with a consistent track record to bring packaging solution from concept to high-volume manufacturing.
As a SiP NPI Engineer, you will play a crucial role in developing next generation SiP process for various of end products. You will be deeply involved from early design phase, prove-of-concept phase (POC), multiple NPI build phases, and hand over to MP team until risk ramp. During these phases, work as the key stakeholder to lead OSAT’s process team for process development & qualification per projects assigned. You will also be the major contact window to behavior of our team and collaborate with Internal / external X-function teams.Specific responsibilities include, but not limited to:
- M.S degree in mechanical engineering, physics, materials science or equivalent, with minimum 5 years of experience in IC packaging (for Bachelor, 10 years above experience is required).
- General knowledge / experience in overall SiP process, panel level or wafer level packaging process, including SMT (surface mounting technology), underfill, die attach, wire bond, molding, dicing saw, Laser and sputter thin-film materials.
- Excellent interpersonal skills with both Mandarin & English.
- Extensive experiences about transferring molding with fine pitch IC or sputter thin film processes for EMI shielding, in the context of high-volume semiconductor / packaging / electronics manufacturing.
- Proven track record of leading internal or external team for assembly process development and qualification of semiconductor packages.
- Good understanding and skill for material characterizations, semiconductor packaging, component failure analysis, design for experiments, mechanical simulation and data analysis (JMP).
- Ability to work under pressure with a wide range of people with varying degrees of experience.
- Familiar with quality tools, including SPC, Cpk, DOE, data distribution, data correlation, commonality study and etc.
- Experience of coding, smart manufacturing, digital transformation or AIML is an advantage.
- Apple is an equal opportunity employer that is committed to inclusion and diversity, and thus we treat all applicants fairly and equally. Apple is committed to working with and providing reasonable accommodation to applicants with physical and mental disabilities.
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26.08.2025
A
Apple Camera Engineering Program Manager China, Guangdong Province, Shenzhen
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5 - 10 years of experience (with a minimum of 5 years in engineering development or engineering program management). Minimum bachelor's degree in Engineering, Electrical, Electronic, Mechanical Engineering or equivalent....
Description:
As Engineering Program Manager (EPM) in the New Technology organization, you will be responsible for leading and driving the development of New Technology programs as well as managing all performance associated with the creation of New Technology projects.
- Work with Engineering Management and vendors to define, plan, track, communicate, and escalate as necessary- Provide timely issue resolution and critical path management- Facilitate good communication and provide multiple levels of status across a wide spectrum of individual contributors to executive management- Drive day-to-day engineering build activities at the vendor’s factory to meet overall program objectives
- 5 - 10 years of experience (with a minimum of 5 years in engineering development or engineering program management)
- Minimum bachelor's degree in Engineering, Electrical, Electronic, Mechanical Engineering or equivalent.
- Fluent in English and local language (Mandarin).
- Intensive Traveling required (every weekday).
- Knowledge of the Hardware development process.
- Great leadership skills and ability to inspire team members.
- Excellent communication, organizational and leadership skills.
- Self motivated and proactive with proven creative and critical thinking capabilities.
- Able to communicate well with cross-functional team members, efficiently collaborate with team members to achieve project goals, and contribute positively to the engineering community environment.
- Camera related knowledge/experience as an added advantage
- Operations experience in a manufacturing environment
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26.08.2025
A
Apple Enclosure Global Supply Manager China, Guangdong Province, Shenzhen
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Typically requires demonstrated experience in Supply Chain Management. Effective written and spoken communication skill in English. Education: MSME, or BSME/IE or equivalent. Program Management: the ability to handle all of...
Description:
- Build Support: on site management of mechanical enclosure manufacturing partners to manage the development builds, risk mitigation and ramp.
- Typically requires demonstrated experience in Supply Chain Management.
- Effective written and spoken communication skill in English.
- Education: MSME, or BSME/IE or equivalent.
- Program Management: the ability to handle all of the above tasks and personnel resources.
- Solid communication skills, ability to work in multinational environments, driven and motivated by accomplishing world-class objectives.
- Solid understanding of costing concepts, cost reduction, modeling, etc.
- Knowledge of any of the following preferred: Raw Material, Mechanical subassemblies, enclosures, casings, plastics, grinding, stamping, CNC, mills, lathes, etc.
- Experience in massive data analysis, coding and machine learning would be a plus.
- Ability to travel Internationally.
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25.08.2025
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Apple Technical Program Manager China, Guangdong Province, Shenzhen
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Bachelor degree in Mechanical, Manufacturing or Industrial Engineering or related major. Master or Ph. D degree. Good written and oral communication skills, fluent in English as a working language (verbal...
Description:
Lead a team of Post molding process in the development of Accessories enclosure. During development phase, you will be required to: - Provide technical assessment of existing or new manufacturing partners- Identify manufacturing processes to meet product design- Work with suppliers to develop fixtures to ensure correct performance and mechanical requirementDESCRIPTION:In this highly visible role, you will manage selection, implementation & optimization of manufacturing processes for mechanical enclosure subassemblies for our legendary products. Responsibilities include developing new manufacturing processes to enable future product designs, conducting DOEs to validate process capability, and qualifying processes for mass production.You will utilize your Mechanical Engineering experience and work cross functionally with Product Design Engineering and Industrial Design to assess product features for manufacturability, and recommend capable production processes and equipment.You will work closely with Cupertino-based MDEs in the development of above said processes.Partner with Global Supply Managers to develop new equipment from RFQ through factory implementation, and manufacture and deliver material to downstream supply chain nodes on time and on cost.You will work with Supplier Quality Engineers to drive yield improvement through analyses of part quality, defect pareto, and SPC.A heavy emphasis will be on working with suppliers to define and refine mechanical tooling and fixtures, and establishing process capability and readiness. You may audit supplier secondary processes and assembly processes as well as support product phase builds from prototype through ramp and mass production. Provide leadership at manufacturing sites during development and product production ramp, and drive engineering issues to resolutionUse data to drive process decisions, basic data analysis, DOEs, SPC, etc.Design best-in-class process based on cosmetic and drawing requirement, mapping out and document process flow and details which includes selecting processing equipments, designing corresponding fixtures/consumables/magazines/trays, initiating DOEs to find out the best machine setups, machining path and parameters, and finalizing the process solution from prototype stage to mass production stage.Define part tolerance and specifications by demonstrating process capability to Product Designers and Industrial DesignersOwn yield improvement actions and process change decisions based on statistical process control (SPC) data analysis.Identify, research, develop, and qualify premier equipment manufacturers and suppliers
- Bachelor degree in Mechanical, Manufacturing or Industrial Engineering or related major. Master or Ph. D degree
- Good written and oral communication skills, fluent in English as a working language (verbal and written).
- Min 6 to 10 years of hands-on experience in Design / Manufacturing Process Development experience.
- Ability to learn, implement and use SPC, JMP, GD&T tool to make data driven decisions, and AIML knowledge is a plus.
- Skilled in communicating complex analytics, making data-driven insights accessible and actionable.
- Demonstrate initiative, adaptability and problem-solving skills in a changing and dynamic environment.
- Hands-on experience and technical knowledge in fixture design and various production processes such as CNC (milling, lathing), forming (stamping, forging), surface finishing (polishing, blasting, lapping, anodization), coating (ink, paint), and assembly (gluing, laser welding, heat staking, ultrasonic welding).
- On-site build support, willing to work from factories.
- Ability and willingness to work independently and travel frequently (mainly in Asia).
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25.08.2025
A
Apple Enclosure Global Supply Manager China, Guangdong Province, Shenzhen
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Typically requires demonstrated experience in Supply Chain Management. Effective written and spoken communication skill in English. Education: MSME, or BSME/IE, or equivalent. Program Management: the ability to handle all of...
Description:
- Build Support: on site management of mechanical enclosure manufacturing partners to manage the development builds, risk mitigation and ramp.
- Typically requires demonstrated experience in Supply Chain Management.
- Effective written and spoken communication skill in English.
- Education: MSME, or BSME/IE, or equivalent.
- Program Management: the ability to handle all of the above tasks and personnel resources.
- Solid communication skills to work in multinational environments, driven and motivated by accomplishing world-class objectives.
- Solid understanding of costing concepts, cost reduction, modeling, etc.
- Knowledge of any of the following preferred: Raw Material, Mechanical subassemblies, enclosures, casings, plastics, grinding, stamping, CNC, mills, lathes, etc.
- Experience in massive data analysis, coding and machine learning would be a plus.
- Ability to travel Internationally.
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These jobs might be a good fit
24.08.2025
A
Apple Enclosure Global Supply Manager China, Guangdong Province, Shenzhen
Share
Typically requires demonstrated experience in Supply Chain Management. Effective written and spoken communication skill in English. Education: MSME or BSME/IE or equivalent. Program Management: the ability to handle all of...
Description:
- Build Support: on site management of mechanical enclosure manufacturing partners to manage the development builds, risk mitigation and ramp.
- Typically requires demonstrated experience in Supply Chain Management.
- Effective written and spoken communication skill in English.
- Education: MSME or BSME/IE or equivalent.
- Program Management: the ability to handle all of the above tasks and personnel resources.
- Solid communication skills, ability to work in multinational environments, driven and motivated by accomplishing world-class objectives.
- Solid understanding of costing concepts, cost reduction, modeling, etc.
- Knowledge of any of the following preferred: Raw Material, Mechanical subassemblies, enclosures, casings, plastics, grinding, stamping, CNC, mills, lathes, etc.
- Experience in massive data analysis, coding and machine learning would be a plus.
- Ability to travel Internationally.
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These jobs might be a good fit
24.08.2025
A
Apple Operations Program Manager China, Guangdong Province, Shenzhen
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Bachelor degree or equivalent experience or above, major in business, logistics, trading, electrical engineering or allied technical subject. Proven experience in manufacturing industry or related areas with managing operation background,...
Description:
In this position, you will ensure weekly MPS are met to WW planner's priority, region's mix and overall pack-out qty with explanation of shipment delta, cycle time goal, including SVC requirement. You will provide local support to ensure act as liaison to facilitate the communication and coordination.
- Operation management for overall demand fulfillment follow WW’s priority as well region’s mix- Capacity management for short term and long term- Factory management for guidance to CM and establish balanced working relationship with CM- Project management for NPI readiness thru EOP closure
- Bachelor degree or equivalent experience or above, major in business, logistics, trading, electrical engineering or allied technical subject
- Proven experience in manufacturing industry or related areas with managing operation background, collaborate with or manages cross functional teams
- English & Mandarin proficiency
- Good data analytical skills, ability to gather data, compile information and prepare the reports/updates
- Take the lead to facilitate the communication and coordination on cross functional issue and business
- Strong sense of urgency to take immediate actions for recovery while under high pressure
- Strong self motivation to continue driving excellence
- Result oriented, strong in leadership and organization skills
- Willing to work from CM factory
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These jobs might be a good fit
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M.S degree in mechanical engineering, physics, materials science or equivalent, with minimum 5 years of experience in IC packaging (for Bachelor, 10 years above experience is required). General knowledge /...
Description:
Apple is where individual imaginations gather together, committing to the values that lead to great work. Every one of us shares a belief that we can make something wonderful and share it with the world, changing lives for the better. You will become part of a hands-on development team that sets the standard in encouraging excellence, creativity and innovation. Here, you’ll do more than join something — you’ll define something.As one of us (SiP process NPI team), you will interface between internal product/device design, quality, supply chain, and the external suppliers to develop and deploy new System-in-Package (SiP) technologies. We are looking for individuals who are innovative with a consistent track record to bring packaging solution from concept to high-volume manufacturing.
As a SiP NPI Engineer, you will play a crucial role in developing next generation SiP process for various of end products. You will be deeply involved from early design phase, prove-of-concept phase (POC), multiple NPI build phases, and hand over to MP team until risk ramp. During these phases, work as the key stakeholder to lead OSAT’s process team for process development & qualification per projects assigned. You will also be the major contact window to behavior of our team and collaborate with Internal / external X-function teams.Specific responsibilities include, but not limited to:
- M.S degree in mechanical engineering, physics, materials science or equivalent, with minimum 5 years of experience in IC packaging (for Bachelor, 10 years above experience is required).
- General knowledge / experience in overall SiP process, panel level or wafer level packaging process, including SMT (surface mounting technology), underfill, die attach, wire bond, molding, dicing saw, Laser and sputter thin-film materials.
- Excellent interpersonal skills with both Mandarin & English.
- Extensive experiences about transferring molding with fine pitch IC or sputter thin film processes for EMI shielding, in the context of high-volume semiconductor / packaging / electronics manufacturing.
- Proven track record of leading internal or external team for assembly process development and qualification of semiconductor packages.
- Good understanding and skill for material characterizations, semiconductor packaging, component failure analysis, design for experiments, mechanical simulation and data analysis (JMP).
- Ability to work under pressure with a wide range of people with varying degrees of experience.
- Familiar with quality tools, including SPC, Cpk, DOE, data distribution, data correlation, commonality study and etc.
- Experience of coding, smart manufacturing, digital transformation or AIML is an advantage.
- Apple is an equal opportunity employer that is committed to inclusion and diversity, and thus we treat all applicants fairly and equally. Apple is committed to working with and providing reasonable accommodation to applicants with physical and mental disabilities.
Show more
These jobs might be a good fit
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