Cisco Principal Photonics/Semiconductor Packaging Engineer 

United States, New Jersey 

538123310

Application window is expected to close on 10/10/24

Acacia designs intelligent transceivers using advanced signal processing and photonic integration for the 100G, 400G and 1T bit speed fiber optic transmission market deployed in data center, metro, long-haul and ultra-long haul telecommunication networks.

You will play a key role in the design, development, and transfer to production of leading-edge transceivers utilizing silicon photonics and advanced DSP technology. In addition, you will:

• Develop new package architecture and integration concepts
• Work with OSATs to bring new products to volume production
• Solve technical problems encountered in product prototyping, qualification, and production
• Drive product solutions toward high-performance, high-reliability and low-cost

You will be part of a multi-disciplinary team, including optical, mechanical, electrical, and manufacturing engineers. You will collaborate closely with Acacia’s Silicon Photonics development team on new product designs and with the Product Engineering and Quality teams to ensure smooth transition of our products to Manufacturing.

You have a deep knowledge of semiconductor packaging and a great understanding of how to make high-volume, high-reliability products. You contribute at all stages of product development, from concept to production.

• BS degree with 12+ years of experience in photonics/semiconductor packaging or a Master's/Ph.D. with 10+ years of experience in photonics/semiconductor packaging.
• 10+ years of experience with semiconductor assembly processes such as die bonding, wire-bonding and 2.5D/3D assembly.
• Knowledge of back-end wafer processing.
• Knowledge of materials characterization and failure analysis, IC packaging materials and back-end wafer-level processes.
• Knowledge of SiPh/PIC packaging, including mechanical, thermal, optics, and RF aspects.

• Experience working with OSATs and CMs on volume manufacturing.
• Experience with laser packaging.
• Experience with FEA software for thermal or mechanical analysis.

We tackle whatever challenges come our way. We have each other’s backs, we recognize our accomplishments, and we grow together. We celebrate and support one another – from big and small things in life to big career moments. And giving back is in our DNA (we get 10 days off each year to do just that).