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Apple Silicon photonics / Optical packaging engineer United States, California 339731365
01.08.2024
Minimum Qualifications
- Excellent teamwork and communication skills
- Strong theoretical background in optics and photonics fundamentals, device/module integration
- B.S plus 10 years works experiences in the related field
- Hands-on experience in packaging and measuring fiber-coupled devices
- Hands-on experience in optical component design, simulation and qualification, and single / multi-mode fiber assembly using active and passive alignment tool
Preferred Qualifications
- M.S and or Ph.D. in Physic (Optics major), Electrical Engineering, Materials Science, Mechanical Engineering or an equivalent field desired, preferred.
- Min. 5 years works experiences in the related field with M.S and or Ph.D
- Hands-on experience of CMOS BEOL wafer scale processing and flip chip assembly (CoC, CoW, WLP, …) and experience with silicon photonics device (laser, modulator, PD, passive components such as Si WG, MUX/DeMUX is a plus
Pay & Benefits
- At Apple, base pay is one part of our total compensation package and is determined within a range. This provides the opportunity to progress as you grow and develop within a role. The base pay range for this role is between $175,800 and $312,200, and your base pay will depend on your skills, qualifications, experience, and location.Note: Apple benefit, compensation and employee stock programs are subject to eligibility requirements and other terms of the applicable plan or program.
Apple is an equal opportunity employer that is committed to inclusion and diversity. We take affirmative action to ensure equal opportunity for all applicants without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or other legally protected characteristics.
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