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Apple Materials Failure Analysis Engineer 
United States, West Virginia 
249814223

Today
  • In this job role, you will be responsible for performing hands-on failure analysis and in-depth characterisation of materials using Scanning Electron Microscopy (SEM), Focussed Ion Beam (FIB) and other analytical techniques to drive root cause analysis.
  • You will be responsible to develop innovative methods / techniques to aid failure analysis, improve turn around time and ensure equipment utilisation and uptimes.
  • Additionally, you will be responsible to communicating results to cross functional teams and collaborating with them to drive corrective actions.
  • You will be responsible in providing technical updates to upper management.
  • Masters degree in Materials Science, Mechanical Engineering, Chemical Engineering, Polymer Science or related discipline.
  • 5+ years of experience in materials characterization (ceramic, metal, polymer, composites) or failure analysis.
  • 2+ years of hands on experience in operating Focussed Ion Beam (FIB), Scanning Electron Microscopy) and Electron Back Scatter Diffraction (EBSD).
  • Good understanding of mechanical behaviour of materials and structure property correlation.
  • Creating comprehensive technical reports with crisp and concise data for presenting to cross-functional teams
  • Excellent verbal and written communication and presentation skills.
  • Strong interest in problem solving and can do attitude
  • Ability to communicate complex technical information in a simple, concise manner
  • Adaptability to fast changing environment and scope of work to meet business needs
  • Ability to prioritise and juggle multiple high priority tasks at the same time
  • Willing to collaborate closely across organisations
  • Enjoys working in a fast-paced environment
  • PhD. in Materials Science, Mechanical Engineering, Chemical Engineering, Polymer Science or related discipline.
  • 10+ years of experience in materials characterization (ceramic, metal, polymer, composites) with at least 5+ years of experience in the semiconductor or consumer electronics industry.
  • 5+ years of hands on experience in operating Focussed Ion Beam (FIB), Scanning Electron Microscopy) and Electron Back Scatter Diffraction (EBSD).
  • Hands on experience in Transmission Electron Microscopy (TEM), (Scanning Transmission Electron Microscopy (STEM), XRD (X-ray Diffraction).
  • Experience with FTIR and other spectroscopic techniques (Raman, UV-VIS, etc) is a plus.
  • Experience in technically mentoring and managing Jr. Engineers and / or technicians.
  • Expertise in mechanical behaviour of materials and structure property correlation.