המקום בו המומחים והחברות הטובות ביותר נפגשים
What you'll be doing:
As part of a Layout team, you will collaborate to implement high speed/density ASIC packages.
Perform substrate breakout patterns for ASIC packages.
Optimize package pinout incorporating system level trade-offs of pins assignment.
Help perform package routing, placement, stack-up, reference plane and power distribution using Cadence APD or SiP tool suite.
Propose layout design trade-offs to the Technical Package Lead for resolution and implementation.
Conduct design feasibility studies to evaluate the Package design goals for size, cost, and system performance.
Develop symbols and CAD library databases using Cadence APD design tools
Develop methodologies to improve layout productivity
What we need to see:
Hold a B.S. Electrical Engineering or equivalent experience
5+ years experience in PCB Layout of graphics cards, motherboards, line cards or other related technology. Experience with HDI designs is a plus
Proven experience in substrate layout of wire bond and flip chip packages, preferred
Significant background with Cadence APD or SiP and/or PCB layout tools (including Constraint Manager)
Your validated working knowledge of high-speed design signal integrity practices
Experience using Valor is helpful
You will also be eligible for equity and .
משרות נוספות שיכולות לעניין אותך