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Nvidia Senior Package Layout Engineer - Hardware 
United States, Texas 
176731513

18.08.2024

What you'll be doing:

  • As part of a Layout team, you will collaborate to implement high speed/density ASIC packages.

  • Perform substrate breakout patterns for ASIC packages.

  • Optimize package pinout incorporating system level trade-offs of pins assignment.

  • Help perform package routing, placement, stack-up, reference plane and power distribution using Cadence APD or SiP tool suite.

  • Propose layout design trade-offs to the Technical Package Lead for resolution and implementation.

  • Conduct design feasibility studies to evaluate the Package design goals for size, cost, and system performance.

  • Develop symbols and CAD library databases using Cadence APD design tools

  • Develop methodologies to improve layout productivity

What we need to see:

  • Hold a B.S. Electrical Engineering or equivalent experience

  • 5+ years experience in PCB Layout of graphics cards, motherboards, line cards or other related technology. Experience with HDI designs is a plus

  • Proven experience in substrate layout of wire bond and flip chip packages, preferred

  • Significant background with Cadence APD or SiP and/or PCB layout tools (including Constraint Manager)

  • Your validated working knowledge of high-speed design signal integrity practices

  • Experience using Valor is helpful

You will also be eligible for equity and .