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Apple IC Package Design Engineer United States, California 148554341
28.03.2024
Key Qualifications
- As the IC Package Design Engineer, you demonstrate fundamental knowledge or proven experience in the following:
- Proven fundamentals in the electrical/material/thermal/ or mechanical engineering field(s).
- Familiarity with various sophisticated package configurations and assembly/ substrate technology (wirebond, POP, etc.).
- Knowledge of package design and proficient in Cadence Allegro platform tools (PCB Editor, Advanced Package Designer, APD/SiP) or Mentor Xpedition platform tools.
- Basic understanding in some SI/PI tools (XtractIM, PowerSI, HFSS, Q3D, etc.), package model extraction, S-parameters and RLGC model.
- Basic knowledge of substrate manufacturing process, structure, design rules and material property.
- Proven understanding of high-speed interfaces, including DDR, PCIe, NAND, etc.
- Exposure to Unix environment, scripting languages (PERL, Python, TCL and or shell) and methodology.
- Preferred Skills:
- Familiarity with CAM350/Valor or Calibre and CAD and experience with package design reviews.
- Knowledge of high-speed layout constraints (crosstalk mitigation, differential pairs, EMI/RFI, PCB/package resonance).
- Design experience with RFIC and 5G packages, SIP or module schematic and layout design experience.
- Solid understanding of Design Rules Check and Design for Manufacturing.
Description
- Implement the physical design of packages and modules for SoC, Memory, RF and cellular chips. - Interface and coordinate with multi-functional groups throughout Apple on new product package/SiP/module feasibility analysis, design and selection. - Define and develop design verification and automation strategy to strengthen and streamline package design as well as release flows.- Work multi-functionally to optimize package pin out. - Perform extraction of S-parameters and package RLGC model. - Ensure package design is optimized with SI/PI requirements.- Drive methodology, innovations, and efficiency improvements in package design together with vendors and developers on feature development and bug resolution.- Explore, evaluate and develop new CAD tool, design and verification flow. - Partner with Silicon PD team to optimize chip Floorplan and bump placement, and minimize package size.
Education & Experience
- BS degree required. MS Preferred.
Pay & Benefits
- At Apple, base pay is one part of our total compensation package and is determined within a range. This provides the opportunity to progress as you grow and develop within a role. The base pay range for this role is between $48.66 and $84.09/hr, and your base pay will depend on your skills, qualifications, experience, and location.Note: Apple benefit, compensation and employee stock programs are subject to eligibility requirements and other terms of the applicable plan or program.
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