Implement the physical design of packages and modules for SoC, Memory, RF and cellular chips.Define and develop design verification and automation strategy to strengthen and streamline package design as well as release flows.Work multi-functionally to optimize package pin out.Perform extraction of S-parameters and package RLGC model.Ensure package design is optimized with SI/PI requirements.Drive methodology, innovations, and efficiency improvements in package design together with vendors and developers on feature development and bug resolution.Explore, evaluate and develop new CAD tool, design and verification flow.