דרושים ב-Applied Materials ב-Taiwan, Hsinchu

Key Responsibilities

• Drives the adoption of new technology at the customer site. Manages a team that works closely with customers to demonstrate and introduce new technologies at customer sites, through Demos, on site evaluations, Joint Development Programs and new toolqualifications.
• Serves as liaison between the customer and the Business Unit for assigned projects, ensuring clear understanding of customer issues and delivery of applicable solutions.
• Manage PSEs providing highly visible customer support through the performance of on-site installation, as well as any necessary diagnoses, troubleshooting, service, and repair of complex equipment and systems.
• Oversees team that checks and approves operational quality of system equipment. Team instructs customers in the operation and maintenance of the system.
• Responsible for training and certification of PSEs into their areas of assigned responsibility
• Responsible for demand planning and financial forecast of activity

Qualifications

• Master’s degree in Chemistry, Physics, Materials Engineering, Electrical Engineering, Optoelectronics, or related field

• Minimum 10 years of experience in semiconductor process engineering or technical support, with a strong focus on EPI products and technologies

• Proven track record of working with TSMC as a key customer

• Demonstrated leadership and team management skills, with experience in driving cross-functional projects

• Fluent in English and Mandarin

Key Responsibilities

• Serves as liaison between the customer and the Business Unit for assigned projects, ensuring clear understanding of customer issues and delivery of applicable solutions.
• Manages PSEs providing highly visible customer support through the performance of on-site installation, as well as any necessary diagnoses, troubleshooting, service, and repair of complex equipment and systems.
• When necessary, works closely with customer to optimize tool performance to meet customer process and integration requirements.
• Checks and approves operational quality of system equipment. Instructs Junior PSEs and customers in the operation and maintenance of the system.
• Oversee training and certification of Junior PSEs into their areas of assigned responsibility

Qualifications

• Master’s degree in Chemistry, Physics, Materials Engineering, Electrical Engineering, Optoelectronics, or related field
• Minimum 10 years of experience in semiconductor process engineering or technical support, with a strong focus on Etch products and technologies
• Proven track record of working with TSMC as a key customer
• Demonstrated leadership and team management skills, with experience in driving cross-functional projects
• Fluent in English and Mandarin

Key Responsibilities

• Act as the primary interface for TSMC on Varian implant tools OR Advanced Packaging applications, ensuring Applied Materials secures opportunities in advanced nodes and packaging technologies.
• Develop and implement account strategies to support technology transitions.
• Lead negotiations on tool bridging, warranty extensions, and resource planning for fab ramp-up and high-volume manufacturing.
• Consolidate risk assessments and opportunity applications across multiple nodes; ensure Applied Materials maintains competitive positioning.
• Coordinate new tool introductions, NSO (New System Orders), and relocation requirements for advanced fabs.
• Engage with TSMC R&D teams to influence design-to-order (DTO) decisions.
• Present Applied Materials’ product roadmap and capabilities; communicate customer requirements to internal product teams.
• Prepare and negotiate pricing proposals, manage order booking, and monitor account receivables.
• Maintain detailed documentation of customer interactions, visit summaries, and action plans; ensure timely execution.

Requirements

• M.S. or B.S. degree in Engineering or related field.
• 2+ years of semiconductor sales experience with one or more of the following tools: DDP, CMP, ETCH, IMP, MDP, PDC, FEP.
• Proven experience in technical sales or account management, preferably with TSMC or semiconductor industry customers.
• Strong interpersonal and communication skills with ability to influence at all levels.
• Excellent English communication and presentation skills.
• Ability to travel as needed (approx. 20%).

Why This Role Is Exciting

This isn’t just an entry-level HR role—it’s your. We’re looking forwho want to learn, innovate, and influence how people and organizations succeed. You’ll work alongside experienced HR professionals and business leaders, gaining exposure toand. Think of this as yourfor a career in HR.

What You’ll Do

• Partner & Learn: Collaborate with professional HRBPs and HR leaders to understand how HR drives business success. Play a role to support the driving force.

• Talent Impact: Support HR analytics, business and employee engagement programs that shape our future workforce. Contribute in ideas and planning skills to route out impactful programs.

• Culture Builder: Contribute to initiatives that foster inclusion, innovation, and growth.

• Data-Driven Decisions: Learn to use HR analytics to solve problems and improve processes.

• Project Ownership: Take on meaningful projects in areas like change management and employee experience.

What We’re Looking For

• Bachelor or Master degree in HR, Business, Psychology, or related field.

• A growth mindset and passion for people and organizational success .

• Strong communication and collaboration skills, willing to learn and contribute; highly commitment to goals.

• Strong data analytics and AI tools leverage skills.

• Curiosity, adaptability, and the confidence to share ideas.

• Detail minded, can deliver flawless execution.

• Proficiency in English and Mandarin language skills for working with domestic and global teams.

• Location: This role is based in AppliedHsinchuoffice. Can work/commit to on-site office Monday to Friday (5 days a week) model with flexibility provided for needed.

Why Join Us?

• Fast-Track Development: Structured learning and mentorship from senior HR leaders.

• Global Exposure: Work in a dynamic, multicultural environment.

• Impact from Day One: Your ideas matter here.

• Future Opportunities: This role is designed for high-potential talent who want to grow into strategic HR roles and interested in Semiconductor and Display industry.

Key Responsibilities

• Serves as liaison between the customer and the Business Unit for assigned projects, ensuring clear understanding of customer issues and delivery of applicable solutions.
• Manages PSEs providing highly visible customer support through the performance of on-site installation, as well as any necessary diagnoses, troubleshooting, service, and repair of complex equipment and systems.
• When necessary, works closely with customer to optimize tool performance to meet customer process and integration requirements.
• Checks and approves operational quality of system equipment. Instructs Junior PSEs and customers in the operation and maintenance of the system.
• Oversee training and certification of Junior PSEs into their areas of assigned responsibility

Qualifications

• Master’s degree in Chemistry, Physics, Materials Engineering, Electrical Engineering, Optoelectronics, or related field
• Minimum 10 years of experience in semiconductor process engineering or technical support, with a strong focus on MDP products and technologies
• Proven track record of working with TSMC as a key customer
• Demonstrated leadership and team management skills, with experience in driving cross-functional projects
• Fluent in English and Mandarin

What You’ll Do

.

Role Responsibilities

• 中日文雙語輪班人員 /需配合四班二輪（3個月日班, 3個月夜班。每日工時 12hr, 做二休二）
• Create under limited supervisionquotations/opportunitiesin ERP system and provide to customer
• Create under limited supervision and maintain accurate Sales Orders in ERP
• Escalate and follow up on customer requirements not being met
• Handle customer inquiries via phone, e-mail, and fax
• Generate reports & track orders, opportunities, booking and shipment
• Develop understanding of customer requirements and relationship with customers
• Develop basic knowledge of AMAT products
• Customer parts, return, repair, service requests interaction and processing
• Quote, part# inquiry, problem parts, pricing issue follow up and update
• Order management incl. book, tracking, update, change and troubleshoot
• Entitlement checks
• Service dispatch
• Part expedites, fulfillment and delivery coordination
• Customer escalation follows up and update
• Multi-regions support for the above scope

Qualifications

• 中日語輪班人員
• 日文檢定 JLPT N1 , and TOEIC550 or above
• Bachelor’s degree or above in anyMajors. InternationalBusiness and business administration are preferred
• 3 year above experience in order management & customer service areas are preferred
• Excellent communication and coordinationskills 優秀的中文及日文電話溝通技巧、文書溝通流利
• Personality with positive, proactive, detail-oriented, and responsible

Preferred Qualifications

• 熟悉SAP操作，有訂單管理相關經驗尤佳
• Customer Service experience

Key Responsibilities

Enable Next-Gen Solutions Through Direct Engagement:

• Act as the technical owner for PVD solutions at assigned OSATs and Fabless accounts, ensuring alignment between design requirements and manufacturing processes.

• Understand Customers and Fabless stakes holders technical roadmap.

• Partner with Fabless packaging architects to define material stacks, reliability criteria, and integration flows; translate these into executable solutions for OSATs.

• Lead joint qualification programs involving Fabless and OSAT stakeholders: define success metrics, DoEs, and acceptance gates; manage execution to schedule.

Process Qualification & Ramp:

• Establish process-of-record (POR) for advanced packaging applications (e.g., RDL barrier/seed, TSV liners, hybrid bonding underlayers).

• Drive tool acceptance (FAT/SAT) and HVM ramp at OSAT sites: SPC setup, chamber matching, defectivity control, and yield stabilization.

• Validate PVD film integrity under Fabless-driven reliability tests (JEDEC/IPC standards: EM, TDDB, thermal cycling).

Cross-Functional Collaboration:

• Coordinate with Applied Materials’ Product Engineering, Field Service, and Quality teams to deliver robust solutions tailored to OSAT and Fabless needs.

• Resolve integration challenges across packaging flows (e.g., ESD, adhesion, contamination, stress) through structured problem-solving.

Continuous Improvement:

• Lead structured root cause analysis on yield/reliability excursions; implement corrective actions and verify effectiveness.

• Provide feedback to internal engineering for hardware and process enhancements based on OSAT and Fabless requirements.

Required Qualifications

• Bachelor’s or Master’s in Materials Science, Physics, Chemical Engineering, or related field; PhD preferred.

• 10+ years in semiconductor equipment/process engineering with strong PVD experience in Advanced Packaging (FO-WLP, 2.5D/3D, RDL/UBM).

• Proven success enabling solutions through direct engagement with OSATs and Fabless design houses.

Preferred Qualifications

• Experience enabling hybrid bonding or chiplet integration through PVD underlayers.

• Familiarity with APAC OSAT ecosystem and Fabless packaging roadmaps.

• Proficiency in SPC, DOE, metrology, and yield analytics.

• Expertise in thin-film metallurgy (Cu, Ni, Ti, Ta/TaN, Co) and reliability-critical stack design.

• Strong communication skills to engage executive Fabless stakeholders and OSAT engineering teams.