Applied Materials Account Sales III - S3 

Taiwan, Hsinchu 

261228456

Key Responsibilities

• Act as the primary interface for TSMC on Varian implant tools OR Advanced Packaging applications, ensuring Applied Materials secures opportunities in advanced nodes and packaging technologies.
• Develop and implement account strategies to support technology transitions.
• Lead negotiations on tool bridging, warranty extensions, and resource planning for fab ramp-up and high-volume manufacturing.
• Consolidate risk assessments and opportunity applications across multiple nodes; ensure Applied Materials maintains competitive positioning.
• Coordinate new tool introductions, NSO (New System Orders), and relocation requirements for advanced fabs.
• Engage with TSMC R&D teams to influence design-to-order (DTO) decisions.
• Present Applied Materials’ product roadmap and capabilities; communicate customer requirements to internal product teams.
• Prepare and negotiate pricing proposals, manage order booking, and monitor account receivables.
• Maintain detailed documentation of customer interactions, visit summaries, and action plans; ensure timely execution.

Requirements

• M.S. or B.S. degree in Engineering or related field.
• 2+ years of semiconductor sales experience with one or more of the following tools: DDP, CMP, ETCH, IMP, MDP, PDC, FEP.
• Proven experience in technical sales or account management, preferably with TSMC or semiconductor industry customers.
• Strong interpersonal and communication skills with ability to influence at all levels.
• Excellent English communication and presentation skills.
• Ability to travel as needed (approx. 20%).