What You'll Do- Perform full-chip Physical Design; Die-size estimation and coordination across multiple teams; floor-planning and routing.
- Perform full-chip DRC, LVS and ANT; review and debug issues; provide solutions; and ensure signoff clean results.
- Provide all necessary inputs to block owners, e.g. block shapes, pin location, IP location, etc.
- Collaborate with block level PD teams to understand each block’s behavior and implementation challenges.
- Work closely with packaging team to implement chip bump map.
- Work closely with vendors providing IPs, to make sure IPs are implemented correctly physically.
Minimum Qualifications:- 5+ years of experience in Top-level physical design, including debugging and providing solutions.
- Experience in deep submicron CMOS technologies relevant to process.
- Solid understanding and experience in CMOS Digital Design Flow.
- Bachelor's or Master's degree in Electrical Engineering or Computer Science or any other relevant field.
- Excellent verbal and written communication skills in English.
Preferred Qualifications:- Experience in physical verification (DRC, LVS) and EM/IR.
- Understanding of the full physical design cycle from RTL to GDSII.
- Hands-on experience in ASIC implementation and verification.
- Knowledge of scripting languages (Python, Tcl, Shell).
But “Digital Transformation” is an empty buzz phrase without a culture that allows for innovation, creativity, and yes, even failure (if you learn from it.)