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Apple NAND Packaging Engineer United States, California, Cupertino 93018272
06.06.2024
Key Qualifications
- Experience in the packaging design and assembly process development for stacked-die memory packages.
- Proven knowledge of wirebond and flip-chip assembly process applied to thin-die stacking.
- Hands on experience using packaging materials, substrate technology, and their mechanical and thermal behaviors.
- Proficient in assembly design rules, SIPI, and layout tradeoffs to enable high performance DDR or differential signaling.
- Confirmed abilities working in package test and reliability, system-level downstream process interaction, and packaging inspection metrology.
- Excellent logic, critical thinking skills with strong engineering physics and data driven analysis.
- Strong written and verbal communication skills for working with internal multi-functional teams and OSATs.
Education & Experience
- BS and 10+ years of relevant industry experience.
Pay & Benefits
- At Apple, base pay is one part of our total compensation package and is determined within a range. This provides the opportunity to progress as you grow and develop within a role. The base pay range for this role is between $170,700 and $300,200, and your base pay will depend on your skills, qualifications, experience, and location.Note: Apple benefit, compensation and employee stock programs are subject to eligibility requirements and other terms of the applicable plan or program.
Apple is an equal opportunity employer that is committed to inclusion and diversity. We take affirmative action to ensure equal opportunity for all applicants without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or other legally protected characteristics.
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