Broadcom DCIM Equipment Engineer 

United States, Colorado, Fort Collins 

691144556

Semiconductor DCIM Equipment Engineer

As a DCIM Equipment Engineer with the Wireless Semiconductor Division (WSD) of Broadcom Inc., you will maintain, optimize and troubleshoot equipment for CVD and PECVD in a 24/7 HVM manufacturing environment. You will be responsible for ensuring quality maintenance practices and bringing the equipment to repeatable standards expectations for process quality. You will be involved in supporting both production and R&D teams in a high volume dynamic product mix manufacturing environment.

Specific Objectives and Responsibilities:

• Work with peers and equipment maintenance teams with respect to safety, quality, yield, reliability, productivity, cycle time, and cost reduction.

• Responsible for tool installations, moves and decommissions per established procedures.

• Be the owner of all efforts regarding owned equipment that improve safety, tool productive time and operational efficiency.

• Characterize and document improvements via established methods and systems. Maintain and update documentation for all impacted customers. Use statistical methods to communicate results and drive improvements.

• Work with process development groups and others in manufacturing to ensure tools meet the quality standards.

• Be involved at times in new tool selection, acceptance, and start-up as well as optimization and upgrade work to improve performance on tooling platforms.

• Establish KPI’s and utilize SPC/FDC to monitor performance with robust setups to detect tool deviations and establish preventive maintenance.

• Manage multiple priorities in a dynamic environment, provide training to the equipment maintenance team and effectively delegate task to enable resolution of issues in a timely manner.

• Work effectively with procurement and vendors to drive quality and responsiveness.

Requirements:

• BS (MS preferred) in Physics, ME, EE or related discipline.

• 2 or more years of experience with wafer process manufacturing equipment maintenance and troubleshooting in HVM.

• Experience with thin film deposition on CVD, PECVD and Diffusion.

• Experience with Implant, Milling, Backgrinders or Diesaw tools a plus.

• Solid understanding of SPC, data driven decision making and able to demonstrate problem-solving skills through controlled documented processes to minimize risk.

• ­­Excellent teamwork, good verbal and written communication skills. Able to organize, coordinate and handle multiple tasks at once and self-prioritize to meet expectations.

• Familiar with statistical methods and software. JMP, Klarity, FDC, etc.

Compensation and Benefits

The annual base salary range for this position is $73,000 - $117,000.

This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements.