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Broadcom Package Design Engineer 
United States, Colorado, Fort Collins 
639818272

06.04.2025

RESPONSIBILITIES:

or more years experience with Cadence APD, SiP, or equivalent package layout CAD tool (3 or more years is preferred)

Package Design of critical structures for SerDes, ADC/DAC, DDR, etc.

Schedule, prioritize, & track your work across 2+ projects simultaneously

General flip-chip BGA package design & engineering

Contribute to efficiency improvements for the design group


EDUCATION/EXPERIENCE & REQUIREMENTS:

BSEE or similar field and 8+ years’ experience in flip-chip-BGA package design, including high-speed SerDes or MSEE or similar field and 6+ years’ experience in flip-chip-BGA package design, including high-speed SerDes

Knowledge of package-level signal integrity and power integrity, to apply to package designs

Cadence APD (allegro package designer) experience is preferred. Equivalent tool is OK.

Self-management and organization skills

Compensation and Benefits

The annual base salary range for this position is $107,000 - $190,000.

This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements.