Broadcom Package Design Engineer 

United States, Colorado, Fort Collins 

586693512

RESPONSIBILITIES:

2 or more years experience with Cadence APD, SiP, or equivalent package layout CAD tool (3 or more years is preferred)

Package Design of critical structures for SerDes, ADC/DAC, DDR, etc.

Schedule, prioritize, & track your work across 2+ projects simultaneously

General flip-chip BGA package design & engineering

Contribute to efficiency improvements for the design group

EDUCATION/EXPERIENCE & REQUIREMENTS:

BSEE or similar field and 8+ years’ experience in flip-chip-BGA package design, including high-speed SerDes or MSEE or similar field and 6+ years’ experience in flip-chip-BGA package design, including high-speed SerDes

Knowledge of package-level signal integrity and power integrity, to apply to package designs

Cadence APD (allegro package designer) experience is preferred. Equivalent tool is OK.

Self-management and organization skills

Compensation and Benefits

The annual base salary range for this position is $107,000 - $190,000.

This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements.