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Apple Technical Program & Quality Manager System-in-Package United States, California, Cupertino 442478299
07.04.2025
- 7+ Experience in semiconductor packaging or electronic assembly processes, including SMT, underfill/mold, laser, PVD/coating, bending, testing, and other related technologies.
- B.S or M.S in Mechanical Engineering, EE, Material Science or related
- Strong understanding of product quality and reliability, with a knowledge of industry standards and best practices.
- Proven problem-solving and debugging skills with a proactive approach to addressing complex technical challenges, leveraging expertise in FA techniques and commonality studies to identify root causes and implement effective corrective actions.
- Data-driven decision-making, with proficiency in tools such as JMP and Tableau for analysis and visualization.
- Experience collaborating with Asia-based manufacturing suppliers to ensure quality and maintain strong partnerships.
- Proven ability to work effectively within cross-functional teams, promoting collaboration among diverse individuals with varying levels of expertise.
- Exceptional interpersonal and communication skills, with the ability to clearly articulate technical concepts, create comprehensive documentation, and deliver impactful presentations.
- Strong program and project management skills, with the ability to prioritize tasks and deliver results in fast-paced environments.
Note: Apple benefit, compensation and employee stock programs are subject to eligibility requirements and other terms of the applicable plan or program.
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