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Google Heterogeneous Integration Engineer Hardware Quantum AI 
United States, California 
425357213

31.07.2024
Minimum qualifications:
  • Bachelor's degree in Physics, Chemistry, Mechanical, Materials Science, Electrical Engineering, a related field, or equivalent practical experience.
  • 3 years of experience developing and sustaining hybridization processes in a cleanroom environment.
  • Experience with one or more of the following: device characterization, SPC or process monitoring/specifications, electrical test, failure analysis.
  • Experience in conventional hybridization techniques, including flip chip hybridization, die processing, and post hybridization measurement.

Preferred qualifications:
  • Master's degree or PhD in Physics, Chemistry, Mechanical, Materials Science, Electrical Engineering, or a related field.
  • 5 years of experience working in semiconductor research and development or production environments.
  • Experience with developing novel bump materials, scaling up die sizes, flip-chip bonding, or designing robust structural bonding solutions.
  • Experience with statistical process control, failure analysis activities, data analysis, and visualization tools such as JMP, Python, or SQL.
  • Experience with characterization techniques including SEM, AFM, confocal microscopy, and interferometry.
  • Excellent communication, documentation, and organization skills, with the ability to present facts clearly and concisely to all staff members.