Bachelor’s degree in Materials Science, Electrical Engineering, Chemical Engineering, Physics, or related technical field, or equivalent practical experience.
Experience with front and back end semiconductor wafer processing.
Experience with advanced packaging.
Experience with data analysis software.
Preferred qualifications:
Master's of Science or Ph.D. in Materials Science, Electrical Engineering, Chemical Engineering, Physics or related technical field.
Experience in statistical process control (SPC) and assessing manufacturability.
Experience with emerging technology process development, including superconducting devices, photonics, and micro-electromechanical systems (MEMS).
Excellent written and verbal communication skills.