Marvell Manager Ethics & Compliance 

Canada 

395819271

What You Can Expect

• Design and develop 2.5D packages, such as CoWOS.

• Utilize IC package layout tools like Cadence APD or Mentor XPD.

• Implement IC package design requirements for high-speed interfaces and manage setup constraints.

• Interface with IC physical design teams to optimize the ASIC die floor plan.

• Collaborate with substrate suppliers, OSATs, and silicon fab vendors.

• Work with IC package assembly development teams to understand and meet assembly requirements.

• Automate layout tasks using scripting.

• Design power planes and translate power supply requirements into the design.

• Stay updated with IC packaging technologies, materials, substrate design rules, and assembly rules.

• Contribute to new product introductions from concept through development and production.

• Apply knowledge of thermal and mechanical analysis in IC package development.

• Communicate effectively and document processes clearly.

What We're Looking For

• Bachelor’s degree in Computer Science, Electrical Engineering or related fields and 5-10 years of related professional experience.

• OR Master’s degree and/or PhD in Computer Science, Electrical Engineering or related fields with 3-5 years of experience.

• Experience with 2.5D package design and development, such as CoWOS.

• Strong expertise in using IC package layout tools like Cadence APD or Mentor XPD.

• Understanding of IC package design requirements for high-speed interfaces and setup constraints manager.

• Experience in interfacing with substrate suppliers, OSATs, and silicon fab vendors.

• Experience with IC layout tools is highly desired.

• Ability to automate layout tasks using scripting.

• Familiarity with IC packaging technologies, materials, substrate design rules, and assembly rules.

• Track record of new product introduction from concept through development and production is a plus.

• Knowledge of thermal and mechanical analysis of IC package development is a plus.

• Strong communication, presentation, and documentation skills.