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Apple SiP DFM Process Engineer United States, California, Cupertino 311343258
23.01.2025
Minimum Qualifications
- 7+ years experience with SMT (surface mounting technology), underfill, molding, dicing saw, all in the context of high-volume semiconductor/packaging/electronics manufacturing.
- B.S in Materials Science, Chemical Engineering, Physics, Mechanical Engineering, or related fields
Preferred Qualifications
- Prior experience with development and qualification of semiconductor packages a plus
- Good understanding and skill for material characterizations, semiconductor packaging, component failure analysis, design for experiments, and data analysis.
- Ability to work with a wide range of people with varying degrees of experience.
- Excellent communication skills.
Pay & Benefits
- At Apple, base pay is one part of our total compensation package and is determined within a range. This provides the opportunity to progress as you grow and develop within a role. The base pay range for this role is between $165,500 and $248,700, and your base pay will depend on your skills, qualifications, experience, and location.Note: Apple benefit, compensation and employee stock programs are subject to eligibility requirements and other terms of the applicable plan or program.
Apple is an equal opportunity employer that is committed to inclusion and diversity. We take affirmative action to ensure equal opportunity for all applicants without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or other legally protected characteristics.
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