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Apple DFM Engineer- SiP NPI China, Guangdong Province, Shenzhen 889716306
14.04.2025
Apple is where individual imaginations gather together, committing to the values that lead to great work. Every one of us shares a belief that we can make something wonderful and share it with the world, changing lives for the better. You will become part of a hands-on development team that sets the standard in encouraging excellence, creativity and innovation. Here, you’ll do more than join something — you’ll define something.As one of us (SiP process NPI team), you will interface between internal product/device design, quality, supply chain, and the external suppliers to develop and deploy new System-in-Package (SiP) technologies. We are looking for individuals who are innovative with a consistent track record to bring packaging solution from concept to high-volume manufacturing.
As a SiP NPI Engineer, you will play a crucial role in developing next generation SiP process for various of end products. You will be deeply involved from early design phase, prove-of-concept phase (POC), multiple NPI build phases, and hand over to MP team until risk ramp. During these phases, work as the key stakeholder to lead OSAT’s process team for process development & qualification per projects assigned. You will also be the major contact window to behavior of our team and collaborate with Internal / external X-function teams.Specific responsibilities include, but not limited to:
- M.S degree in mechanical engineering, physics, materials science or equivalent, with minimum 5 years of experience in IC packaging (for Bachelor, 10 years above experience is required).
- General knowledge / experience in overall SiP process, panel level or wafer level packaging process, including SMT (surface mounting technology), underfill, die attach, wire bond, molding, dicing saw, Laser and sputter thin-film materials.
- Excellent interpersonal skills with both Mandarin & English.
- Extensive experiences about transferring molding with fine pitch IC or sputter thin film processes for EMI shielding, in the context of high-volume semiconductor / packaging / electronics manufacturing.
- Proven track record of leading internal or external team for assembly process development and qualification of semiconductor packages.
- Good understanding and skill for material characterizations, semiconductor packaging, component failure analysis, design for experiments, mechanical simulation and data analysis (JMP).
- Ability to work under pressure with a wide range of people with varying degrees of experience.
- Familiar with quality tools, including SPC, Cpk, DOE, data distribution, data correlation, commonality study and etc.
- Experience of coding, smart manufacturing, digital transformation or AIML is an advantage.
- Apple is an equal opportunity employer that is committed to inclusion and diversity, and thus we treat all applicants fairly and equally. Apple is committed to working with and providing reasonable accommodation to applicants with physical and mental disabilities.
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