Amazon Senior Silicon Reliability Engineer Kuiper Team 

United States, California, Sunnyvale 

100784202

As Senior Silicon Reliability Engineer, you will engage with an experienced cross-disciplinary staff to conceive, design, and manufacture innovative semiconductor solutions for Kuiper satellite and ground terminal products. You will work closely with internal inter-disciplinary teams and third-party suppliers to drive key aspects of semiconductor product reliability, qualification, and manufacturing to meet our customers’ needs. Your scope will span product level qualification, semiconductor process reliability, and failure analysis of field returns. You must be responsive, flexible and able to succeed within an open collaborative peer environment.Export Control Requirement
Key job responsibilities
- Define and execute semiconductor customized product qualification plans (similar to AEC-Q100).
- Write mission profile documents for Kuiper’s custom silicon.
- Work with vendors to design hardware / vector / software solutions for RF-HTOL, burn-in, and ESD testing.
- Analyze qualification data, and drive issue resolutions as well as address potential test gaps and correlations issues throughout the supply and manufacturing chains.- Conduct physical and electrical failure analysis using techniques such as laser decapsulation, emission microscopy, FIB, CSAM, OBIRCH, SEM, and nano-probing.- Set limits for test plans used for pre-/post-qualification lots.
- Interact with suppliers such as foundries and OSATs to run qualification for silicon devices.

- Bachelor's degree in electrical/communications engineering or related field, or equivalent experience.
- 7+ years in semiconductor product engineering or foundry process operations, preferably in high-volume wireless SoC devices manufacturing.
- Up to 10% domestic or international travel required.

- Masters or PhD degree in Electrical / Communications Engineering or related field.
- 10+ years in semiconductor product engineering or foundry process operations, preferably in high-volume wireless SoC devices manufacturing.
- Excellent oral and written communications skills.
- Strong technical background in one or more of the following:
- Semiconductor, package, and PCB design and fabrication processes.
- Silicon debug, Design for Test (DfT), qualification, and release to production.
- RF-HTOL hardware development: boards, sockets, ovens, activity vectors, etc.
- Failure analysis techniques such as laser decapsulation, emission microscopy, FIB, CSAM, OBIRCH, SEM, and nano-probing.
- Data analysis techniques and products such as PDF Exensio, Galaxy Examinator, and JMP.
- Semiconductor fab operations (e.g. WAC, OCAP, RMA) and processing (masks, implant, etch, CMP, bumping, etc.)
- Semiconductor reliability effects such as HCI, NBTI.
- Packaging techniques such as FCBGA, FCCSP, WLCSP, and QFN.
- Proficiency in reviewing and analyzing ATE data for SoC & RF products.