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Microsoft Senior Physical Design Engineer 
Taiwan, Taoyuan City 
100440141

15.05.2025

Required:

  • BS/MS in Electrical or Computer Engineering
  • 10+ years of experience in semiconductor design.
  • Great communication, collaboration and teamwork skills and ability to contribute to diverse and inclusive teams.
  • Proven track record of implementing designs through synthesis, floorplanning, place and route, extraction, timing, and physical verification.

Preffered:

  • Large SoC/CPU/IP design tape-out experience in the latest foundry process nodes.
  • Excellent project management skills and ability to juggle multiple projects at once.
  • Strong understanding of constraints generation, STA, timing optimization, and timing closure.
  • In-depth understanding of design tradeoffs for power, performance, and area.
  • Hands on experience with CTS and global clock distribution methods in multi-voltage, multi-clock, multi-domain, and low power designs.
  • Experience in EDA tools such as Primetime, StarRC, Design Compiler, ICC, Fusion Compiler, Innovus etc.
  • Experience and knowledge of formal equivalency checks, LEC, LP, UPF, reliability, SI, and Noise.
  • Exposure and some hands-on experience with PD flows bring up/setup/flow flush, overall know how of PD-TFM and PD methodology is a big plus
  • Strong problem-solving and data analysis skills
  • Automation skills using scripting languages such as Perl, TCL, or Python.

Ability to meet Microsoft, customer and/or government security screening requirements are required for this role. These requirements include, but are not limited to the following specialized security screenings: Microsoft Cloud Background Check: This position will be required to pass the Microsoft Cloud Background Check upon hire/transfer and every two years thereafter.

Responsibilities

In this high impact role on the team, you will be responsible to:

  • Demonstrate technical expertise in all aspects of Physical Design, from synthesis to place and route of partitions through all signoff including timing signoff, physical verification, EMIR signoff , Formal Equivalence, and Low Power Verification.
  • Own complete PD execution of Sub-systems/Sub-chips instantiating multiple other Physical partitions.
  • Own partition floorplanning for optimizing blocks for Power, Performance and Area.
  • Have close collaboration with RTL team to help drive and resolve design issues related to block closure.
  • Understand tools, flows, and overall design methodology in design construction, signoff, and optimization with a data driven approach.
  • Implement robust clock distribution solutions using appropriate methods that meet design requirements.
  • Make good independent technical trade-offs between power, area, and timing (PPA).
  • Be able to guide and coordinate with all sub-partitions PD to be able to take the Sub-chip through PD (construction through signoff) closure.
  • Additionally flow flush PD TFM on few design partitions for early identification of any design PD flow issues before every PD TFM release is proliferated and deployed across all partitions/subchips for PD execution.
  • Partner closely with PD flow/CAD team and PD methodology team to flag & fix PD TFM issues upfront and ensure those are fixed in the next PD TFM release from CAD or are updated in the design project layer (as appropriate).