דרושים Talent Development Expert V ב-Applied Materials ב-ארהב

Key Responsibilities

-Prepares wafers for experimentation. May include cleaning. Loads wafers, prepares reactor for experimentation and cleans reactors. Operates reactor to perform various processes including metrology. Recommends performance of process system and troubleshooting.

-Coordinates with engineering on wafer evaluations. Sets up equipment for fairly complex experiments.

- Perform routine shut down procedures. Identify problem put tool down and call for service.

-Checks performance of process system and acts on making it compliant to best known method (BKM).

- Records process conditions and experimental observations. Evaluates wafers and coupons, including modification of the process recipes.

- Prepares graphs and tables summarizing results.

- Coordinates with process engineers on wafer evaluations. Sets up equipment for experiments.

-Orders equipment and supplies, and coordinates with vendors and purchasing. Coordinates instrument repair and maintenance.

-Uses quantitative wafer evaluation and process instrumentation knowledge to draw conclusions from data. Assists in training lower level technicians.

- Develop and publish best known method (BKM) procedures including, sample prep, and special sample handling.

-Knowledgeably operates laboratory process equipment and instrumentation.

Functional Knowledge

-Has developed advanced specialized expertise within aanalytical/scientificarea to perform the most complex work

Problem Solving

Exercises judgment, based on previous experience, practices and precedents, to identify and solve problems that arise with little or no precedent

Interpersonal Skills

Exchanges ideas and information effectively; uses tact and diplomacy when dealing with others

This is a physically demanding position that often requires extensive walking, standing for extended periods of time, the ability to work in an environment with noise that may be difficult for some individuals with sensitivity to noise, and the use of hand and power tools. Additionally, because this position involves working in a clean room, it requires the use of appropriate Personal Protective Equipment such as coveralls, hoods, booties, safety glasses, gloves, respirators, chemical aprons, and face shields.

About the Role

We are working on exciting projects, connecting materials to systems, to drive new innovations that enable a wide range of advanced Logic-Memory devices and technologies, and associated material and processes interactions. You can be part of this cutting-edge modeling and design team, where you will have the opportunity to model and simulate new technologies that answers the continuous demands for scaled devices, denser interconnects that significantly improves the system Power, Performance and Area (PPA).

This primary responsibility of this position will be to focus on DTCO modeling to support the unit process and integration flow development for next generation logic and DRAM nodes. You will play a key role in shaping the future of advanced logic and DRAM technologies by providing DTCO simulation-driven insights that influence materials, process and design decisions.

Key Responsibilities

• Development of TCAD process and device models to enable predictive analysis for advanced logic (FinFET, GAA, CFET) and DRAM architectures (6F2, 4F2 VCT and 3D DRAM)

• Development and modification of speculative process integration schemes and risk/benefit assessment.

• Extraction of compact model representation of TCAD simulated devices.

• Layout development/design of standard logic cells and DRAM array

• Interconnect modeling and parasitic resistance and capacitance extraction

• SPICE modeling and PPA projection for benchmark logic circuits & blocks and DRAM array / periphery

• Collaborate with cross-functional teams to define simulation requirements, interpret results, and provide actionable design and process recommendations.

• Support technology roadmap development by evaluating new materials, interconnect structures, process flows and design.

• Drive design-of-experiment (DOE) studies and sensitivity analyses to understand key drivers of electrical performance and reliability.

• Contribute to the development and automation of internal simulation workflows, tools, and best practices to improve modeling efficiency and accuracy.

• Document and present simulation methodologies, results, and recommendations to both technical and executive audiences.

• Stay current with industry trends, emerging technologies, and academic research in advanced packaging and simulation methodologies.

Required Qualifications

• Master’s or Ph.D. in Electrical Engineering, Materials Science, Applied Physics, or a related field.

• 5–10 years of hands-on industry experience with Synopsys 3D TCAD process, device, parasitic extraction and spice modeling tools towards logic or memory technology development.

• Strong fundamental understanding of semiconductor device physics related to logic and DRAM technologies.

• Familiarity with logic (FinFET, GAA and CFET) and DRAM process integration flows (FEOL / MOL / BEOL) and 3D device structures.

• Experience with logic benchmark circuits and PPA evaluation methodologies.

• Experience with DRAM array and periphery operation.

• Experience with scripting and automation (e.g., Python, TCL, MATLAB) to streamline simulation workflows.

• Excellent analytical, problem-solving, and communication skills.

• Proven ability to work independently and collaboratively in a fast-paced, cross-functional environment.

• Strong problem-solving abilities in interdisciplinary areas

• Ability to present scientific and/or experimental results in a concise and convincing manner

• Desire to stay up to date with industry challenges and recent advancements

• Passionate and highly motivated to learn new things

Preferred Qualifications

• Experience with device and circuit level reliability modeling

• Recent experience with writing research papers for conference and journal publications

• Experience with standard cell characterization, RTL synthesis, DRC/LVS and place-and-route and timing analysis flows

• Experience in calibration tohardware/measurementsand correlations

What We Offer

• ​ About the Role

  We are looking for an expert, highly experienced Senior FEA Engineer to join our Advanced Packaging Modeling team in Santa Clara, CA. This is a critical role focused on developing thermal-mechanical simulations to support the design, development, and qualification of next-generation semiconductor packaging technologies. You will play a key role in shaping the future of advanced packaging by providing simulation-driven insights that influence architecture, materials, and process decisions.

  This position offers the opportunity to work at the forefront of semiconductor innovation, collaborating with engineers and researchers across multiple business units including design, process integration, reliability, and manufacturing.

  Key Responsibilities

  • Develop and validate detailed finite element analysis (FEA) models to simulate thermal and mechanical behavior of advanced semiconductor packages.

  • Perform simulations to evaluate stress, strain, warpage, delamination, thermal cycling, and reliability risks across a wide range of package architectures (e.g., flip-chip, fan-out, 2.5D/3D IC, chiplet-based designs, TSVs).

  • Conduct thermal modeling to assess heat dissipation in complex package structures, supporting thermal design optimization and advanced cooling technology development.

  • Collaborate with cross-functional teams to define simulation requirements, interpret results, and provide actionable design and process recommendations.

  • Support technology roadmap development by evaluating new materials, interconnect structures, and process flows from a thermo-mechanical reliability perspective.

  • Drive design-of-experiment (DOE) studies and sensitivity analyses to understand key drivers of package performance and reliability.

  • Contribute to the development and automation of internal simulation workflows, tools, and best practices to improve modeling efficiency and accuracy.

  • Document and present simulation methodologies, results, and recommendations to both technical and executive audiences.

  • Stay current with industry trends, emerging technologies, and academic research in advanced packaging and simulation methodologies.

• ​Required Qualifications

  • M.S. or Ph.D. in Mechanical Engineering, Materials Science, Applied Physics, or a related field.

  • 5–10 years of hands-on industry experiencein thermal-mechanicalFEA modeling, in the semiconductor or electronics packaging domain.

  • Thorough understanding of advanced packaging technologies, including flip-chip, fan-out wafer-level packaging (FOWLP), 2.5D/3D integration, chiplet architectures, and through-silicon vias (TSVs).

  • Proficient with commercial FEA tools such as ANSYS, Abaqus, COMSOL, or equivalent.

  • Strong knowledge of materials behavior, including polymers, metals, ceramics, and their interactions under thermal and mechanical loads.

  • Familiaritywith semiconductorpackaging processes, including die attach, underfill, molding, bumping, and reflow.

  • Excellent analytical, problem-solving, and communication skills.

  • Proven ability to work independently and collaboratively in a fast-paced, cross-functional environment.

  Preferred Qualifications

  • Experiencewith multi-physicssimulations, including coupledelectro-thermal-mechanicalanalysis.

  • Familiarity with JEDEC reliability standards and qualification tests (e.g., TCoB, HTS, uHAST, drop test).

  • Experience with scripting andautomation (e.g.,Python, TCL, MATLAB) to streamline simulation workflows.

  • Exposure to package design tools such as Cadence, Mentor Graphics, or equivalent.

Key Responsibilities

Ensures that specific project and program objectives are defined for areas of responsibility, and that necessary preliminary activities (e.g., determination of outcomes, milestones, viability studies, and resource planning, among others) are completed to allow for effectiveness and focus during later stages of completion.

Ensures that all systems engineering projects and programs assigned are completed in accordance with predetermined requirements, with specific attention to product/process specifications, project/program costs, resource utilization, and timeliness for completion.

Ensures that all phases of project, program and/or process development are documented and that information required in other functional areas is reported, disseminated, or transferred, as appropriate. Ensures compliance with company policies including (but not limited to) engineering/lab notebooks, patents, confidentiality, ISO, safety and others as required.

Effectively assigns work to subordinate staff, providing for professional development in addition to maximum productivity for the area.

Responsible for departmental budgets and spending requirements.

Effectively utilizes computing resources for optimization of design development activities and timelines.

Functional Knowledge

• Demonstrates comprehensive understanding of concepts and principles within own job family and knowledge of other related job families

• Applies in-depth understanding of how own discipline integrates within thesegment/function

Leadership

• Manages multiple related teams, sets organizational priorities and allocates resources

Problem Solving

• Identifies and resolves complex technical, operational and organizational problems

Impact

• Impacts the business results of a team or area by supporting and funding of projects, products, services and/or technologies and developing policies and plans

• Guided by business unit, department or sub-functional business plans

Interpersonal Skills

• Influences others internally and externally, including senior management

Key Responsibilities

Forecasts financial, manpower, and operational requirements for key businesses (start up, warranty, service agreements, paid service). Identifies and pursues service agreement business in conjunction with marketing and sales.

Manages start ups in terms of time and cost requirements. Manages local inventories and RMA procedure. Maintains DSO according to goal. Manages systems start up and warranty cost under reserve.

Ensures employee satisfaction through:

- setting goals and controlling achievements.

- establishing training and career development plans.

Escalates system downs according to valid escalation procedure, to ensure earliest possible return to service. Reports in a timely and accurate manner as required.

Promotes quality improvement processes to:

- reduce cycle time

- drive continuous improvement of technical performance

- empower the workforce. Responsiblefor following departmental procedures to safeguard the health, safety and welfare of themselves and those around them who may be affected by their acts or omissions

Functional Knowledge

• Demonstrates comprehensive understanding of concepts and principles within own job family and knowledge of other related job families

• Applies in-depth understanding of how own discipline integrates within thesegment/function

Leadership

• Manages multiple related teams, sets organizational priorities and allocates resources

Problem Solving

• Identifies and resolves complex technical, operational and organizational problems

Impact

• Impacts the business results of a team or area by supporting and funding of projects, products, services and/or technologies and developing policies and plans

• Guided by business unit, department or sub-functional business plans

Interpersonal Skills

• Influences others internally and externally, including senior management

Major Responsibilities

This is a dynamic role that will enable the candidate to lead financial analysis and revenue management in partnership with Operations. The position requires an individual who is eager to work across functions and levels to provide valued Finance support.

• Business partnering with executive management team; primary finance partner for Business Management and Business Management Operations organizations
• Strategic financial planning, measurement, and execution around value capture opportunities.
• Deal analysis – partnering with Business Management on profitability & commercials. Recommends or leads product or service improvements to commercial deal structures.
• Drive execution towards Days Sales Outstanding and FGI dwell time targets
• Support for BU S&OP Demand Reviews, including scenario planning and market share implications
• Coordination across functions to drive build plan reconciliation alignment
• Bookings, billing, backlog analysis and market share forecast
• Forecasting & delivering predictable financial results
• Close/GAAP, including balance sheet management
• Process improvement in collaboration with peers in SPG
• Key participant on Agile Finance initiatives; lead for one segment-wide initiative
• Solves unique and complex problems that have a broad impact on the business.

Key Competencies

• Business Acumen – business/financial concepts, processes, and practices for sound decisions
• Business Partnering - creating a real and active partnership with both operations and management. Provide 'real time' support and analysis to add value in decision making
• Data Analytics - data analysis tools to sort through and analyze data to identify factors impacting performance and to gain greater insight into trends
• Data Gathering/Reporting - tools, techniques and processes for gathering/reporting data for measuring business results, objectives & strategies
• Financial Forecasting & Modeling - processes, tools, and techniques for exploring and evaluating alternative financial scenarios and results
• Flexibility & Adaptability - approaches, tools, and techniques for dealing with a changing environment
• Influencing - ability to impact decisions within and outside own organization
• Initiative - self-motivation, ability and drive to seek out work and accomplish goals
• Org Change Management – effect change in an organization; ability to manage successful transition from current to desired culture, practices, structure, and environment
• Problem Solving/Critical Thinking - approaches, tools, techniques for solving problems & making sound recommendations
• Very strong Excel skills, including modeling
• Strong communication, including presentation skills
• Basic or intermediate accounting knowledge

Education & Experience

• BS degree in Accounting or Finance; MBA preferred
• 8+ years of experience, semiconductor equipment or components manufacturing preferred

Key Responsibilities

1. Recognized as an expert and drives field/technical and customer engagement from a BU perspective. Conducts calls with field Technical Directors.

3. Has expert understanding of global, technical and market trends and executes a systematic process for capturing competitive intelligence

4. Drives alignment and tracks business focus on TAM, share, margin between BU and Field

5. Leads project teams to achieve milestones/ objectives and map trends, opportunities and threats to roadmap and strategies.

7. Coordinate (TRM) Technical Review workshops with BU.

Functional Knowledge

· Regarded as the technical expert in their particular field

· Demonstrates in-depth and/or breadth of expertise in own discipline and broad knowledge of other disciplines within the function

· Anticipates business and regulatory issues; recommends product, process or service improvements

· Leads projects with notable risk and complexity; develops the strategy for project execution

Problem Solving

· Solves unique and complex problems with broad impact on the business; requires conceptual and innovative thinking to develop solutions

· Impacts the direction and resource allocation for program, project or services; works within general functional policies and industry guidelines

Interpersonal Skills

· Communicates complex ideas, anticipates potential objections and persuades others, often at senior levels, to adopt a different point of view

Bachelor's Degree