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What you will be doing:
Architect thermal solutions for engineering characterization and validation of next gen GPU/SOC products. Deliver these solutions from concept to lab.
Drive thermal solutions roadmap for chip bring-up and align across teams in the company , while managing trade-offs between product needs, schedule and cost. .
Lead end to end design of thermal soluitions with internal teams and external vendors driving design requirements, prototype evaluation, test system integration , SW automation etc.
Improve thermal design process. Drive the enhancement plan from incorporating the design feedback and learnings, and improve the design workflow and process.
Work alongside system architects, chip and board designers, and software/firmware engineers on thermal solution design and implementation, in a multifaceted and high-energy work environment to bring industry-defining products to market.
What we need to see:
Bachelor/Master in EE, Thermal/ Energy, Mechanical Engineering or relative majors, with 8+ years relevant experience.
Strong understanding of thermal management principles and fluid dynamics.
In-depth knowledge of sophisticated cooling solutions, high heat flux problems.
Outstanding communication and program management skills.
Proficiency in CAD software for creating and modifying 3D models of electronic components and cooling systems.
Good silicon testing, board design and software knowledge.
Ways to stand out from the crowd:
Experience working with external vendors on design and deployment.
Familiarity with statistical methods and tools for data analysis
A "go-getter, can get it done" attitude and independent 'out-of-box' thinking.
You will also be eligible for equity and .
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