Oversee the complete mechanical engineering lifecycle, from initial concept and design to production and deployment.
Ensure adherence to rigorous engineering principles and best practices throughout the development process.
Mechanical Design:
Design mechanical components for high-performance AI systems, considering factors such as power consumption, thermal management, and cost-effectiveness.
Collaborate closely with cross-functional teams (e.g., hardware, production, ODMs) to ensure seamless system integration and optimal performance.
Drive the selection and evaluation of key components and technologies.
Manufacturing & Quality:
Ensure the successful transition of designs to manufacturing, including close collaboration with manufacturing partners.
Drive continuous improvement in manufacturing processes to enhance yield, quality, and reliability.
Implement robust design for manufacturability (DFM) and design for quality (DFQ) methodologies.
Qualifications:
Required:
Bachelor’s degree in mechanical engineering (MSc preferred)
7+ years of experience in mechanical engineering, with a strong focus on complex, high-power systems.
Deep understanding of Mechanical/Thermal design and electronics packaging of Air and liquid cooled systems for IT/AI/HPC data-centers
Expertise in different manufacturing methods including sheet-metal, CNC, casting and injection molding for medium and high mass production qtys
Strong analytical and problem-solving skills.
Excellent communication and interpersonal skills.
Preferred:
Experience with Data Centre, AI/ML accelerators, or deep learning systems.
Familiarity with manufacturing processes.
Experience with thermal management solutions for high-power systems.
Knowledge of industry standards and best practices in mechanical engineering.
Experience in reliability and environmental standards and testing BKMs of IT/AI/HPC systems for data-centers.
Experience in FEMstatic/dynamics/fatigueMechanical simulation and thermal/flow (CFD) simulations and analytical thermal/flow calculation
Knowledge in Large BGA ASICs design and reliability testing and simulations