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Job Description:
This is an Software Engineering position for the High Speed Interconnect Products (HSIP).
In this role you will join a team of highly skilled designers involved in design, modeling, verification, firmware and software development for the physical layer of high speed SerDes at speeds of >200Gbps with both analog and digital components.
The types of software implemented include: control and status, debug functions, andinterface/integrationwith analog functions in both firmware and API levels.
Responsibilities may include:
Embedded microcode development for ARM M0+ processor
Application and support software development
Creating web based content and GUI
Optimize implementation at various levels including firmware, API and Application.
Document design and implementation details.
Develop, test and debug firmware associated with physical layer functionality
Lab testing and debug of SerDes IP
Typically requires a BS degree and at least 8 years of experience or an MS degree and at least 6 years of experience or a PhD and more than 4 years of experience developing, implementing, and testing embedded software and hardware products.
Strong software development and debugging skills are mandatory.
5+ years C/C++ programming for embedded applications
(Macros/CPP, data structures, cross compiling, cross debugging, cross platform GUI design)
Experience in building and maintaining GCC build platform including cross compilers and static analysis tools.
SerDes architecture and operation
Expert in GMAKE (Macros, hierarchical builds, recursion)
Expert with LINUX and LINUX Tools (SED, AWK, BASH, EXPECT, FLEX)
Experience in Python programming
Web based or Python GUI design and development
Familiar with ARM processors (embedded programming, assembly)
Good written and verbal communication
Familiar with Source code control and bug tracking systems
Compensation and Benefits
The annual base salary range for this position is$107,000 -$171,000
This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements.
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