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Fab Sort Manufacturing (FSM) is responsible for the production of all Intel silicon using some of the world's most advanced manufacturing processes in fabs in Arizona, Ireland, Israel, Oregon and a new greenfield site in Ohio.Intel recently created the Global Yield organization in FSM to strengthen its yield operation and enable fast-paced yield ramp-up in early HVM phases for each technology in collaboration with Technology Development (TD) team, and FSM fabs.This job requisition is seeking a Sr. Device Characterization Engineer to startup and lead the device characterization operation within the Global Yield Development Lab's Arizona location. Selected expert will lead our offline engineering device characterization lab, developing and executing advanced characterization plans and providing general device troubleshooting support. This high visibility role is a key enabler for device development and process optimization in early production stage for our global development network.Sr. Device Characterization Engineer's responsibilities include (but are not limited to):
Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.Minimum Qualifications:
Preferred Qualifications
Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits Annual Salary Range for jobs which could be performed in the US $153,100.00-$216,140.00*Salary range dependent on a number of factors including location and experienceמשרות נוספות שיכולות לעניין אותך