BS and a minimum of 10 years OR MS/PhD and a minimum of 5-8 years relevant industry experience in Mechanical Engineering, Physics, Materials Science, or similar.
Experience working with high-precision assembly (PnP), semiconductor or MEMS packaging (Overmolding, Bonding, Soldering), or optoelectronic packaging
Experience with Joint-Development-Manufacturing model with contractors to develop equipment, materials, and process to manufacture small, or precision electromechanical/optical systems
English fluency required for both verbal and written communication
Have a growth mindset for self and organization development, actively seeking new ways to grow and cultivating innovation
Preferred Qualifications
Experience engaging with multi-functional teams - Product Design, Product Engineering, Program Management, and Operations
Experience shipping products in high-volume production
Ability to work with international teams in different time zones
Ability to travel to domestic factory partner sites on weekdays