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Broadcom Advanced Package Technology Engineer United States, Colorado, Fort Collins 953821405
05.05.2024
Job Description:
As part of WWASIC productdevelopment team, this individual will work closely with silicon & package design, marketing, NPI, assembly/substrate suppliers & customers and is responsible for developing cost effective high performance, advanced custom package solutions achieving signal integrity, thermal, structural reliability, substrate fab/package assembly design rules & project schedule requirements.
2.5D & 3D iscutting edge package technology withBRCM’s needspushing the technology limits.
Job ScopePackage Technology Engineer)
Provide deeper expertise in 2.5D/ 3D technology; current and future customer engagement on technology needs & updates, consolidation of requirements and drive towards unified solution.
Lead in identification, development & qualification; program management with external assembly partners
Lead in memory supplier(s) engagement to define technology and quality requirements.
Support new design wins, NPI and volume ramps.
Develop alternate sourcing & qualification.
PhD / Master/ Degree in Mechanical / Electrical / Electronics Engineering withyears of relevant experience in developing cost effective, high performance (speed, density, pin count, thermal & reliable), single & multi-chip, large, complex, custom & fine pitch flip chip packaging solution with advanced multi-layer ceramic / organic substrates & Interposers; Standard & thermally enhanced fine pitch leaded & BGA wire bond & wafer level packaging solution.
years Hands On experience in2.5D / 3DDevelopment; In-depth Know-how of Advanced Silicon fab, Bump, Interposer, substrate & assembly processes, materials & supplier selection, BOM definition, thermal and mechanical interactions.
Sound knowledge of & hands on experience in advanced, prevailing and emerging silicon, package & substrate technologies, bumping and assembly processes, design rules, failure analysis tools and techniques, materials and equipment, applicable industry standards, regulations & quality systems.
Hands-on experience of use of modelling (Thermal & Mechanical) & Sub / PCB Design CAD tools (APD, AutoCAD,) for design optimization.
Sound knowledge of advanced node silicon fabrication, PCB technologies and board assembly processes, applicable industry standards, quality systems and regulations.
Compensation and Benefits
The annual base salary range for this position is $91,200 - $152,000
This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements.
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