Qualcomm Staff Engineer Packaging 

United States, California, San Diego 

950821768

Job Area:

Engineering Group, Engineering Group > Packaging Engineering

As an EDA engineer in the advanced packaging space, you'll be at the forefront of hardware design, focusing on 2.5D/3D IC package design and analysis. Your role involves guiding design and EE teams to ensure alignment with the product roadmap and requirements. We're seeking a highly motivated EDA tool researcher and software developer with a semiconductor packaging background to drive new 2.5D and 3D packaging initiatives aligned with Qualcomm’s roadmaps.

Job Description:

• Develop, qualify, and certify 2.5D and 3D package EDA reference flows based on critical KPIs.

• Partner with EDA vendors, SOC Foundries, and packaging SAT houses to influence industry EDA roadmap to meet Qualcomm's product requirements

• Collaborate with internal SOC and packaging design teams to define and deploy the reference flows.

• Develop and Automate tools and methodology to accelerate Package and System Design, Analysis and Verification processes.

Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.

:

$154,000.00 - $231,000.00