Qualcomm Mechanical Engineering Internship – Summer 

United States, California 

943925326

Job Area:

Interns Group, Interns Group > Interim Engineering Intern - HW

Minimum Qualifications

• Currently enrolled in a bachelor’s, master’s, or Ph.D. degree program in computer engineering, computer science, electrical engineering, or a related field

• 1+ years’ academic experience with programming languages such as Python, Matlab

• Must be available for 11 – 14 weeks during Summer 2025 (May-September) with a graduation date of December 2025 or later

Preferred Qualifications

• Familiarity with Cadence Sip, AutoCAD and Solidworks.

• Coursework in Solid Mechanics, Mechanics of Materials and Finite Element Analysis (FEA)

• Knowledge in Mechanical design, heat transfer, microelectronics device.

• Knowledge of IC packaging structures, chip-package, electronic packaging process and package-board interaction.

• Server product design, thermal analysis, system impedance testing, fan performance measurement and heatsink design methodology.

• Computational Fluid Dynamics

• Wind tunnel and/or air flow bench operation

• Candidates actively pursuing a degree with an anticipated graduation within the upcoming year preferred Dec 2025 to June 2026.

It is important to note that this is not a job posting for a specific role.We will review resumes on an ongoing basis, and a recruiter may reach out to you.

Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.

Pay range:

$0.00 - $98.00