Qualcomm Thermal Engineer Sr Staff Principal 

United States, California, San Diego 

933893993

Job Area:

Engineering Group, Engineering Group > Packaging Engineering

The qualified individual will be contributing to innovative solutions resolving complex thermal management challenges supporting Compute products. He/She will apply analytical skills on development of advanced thermal architecture solutions, including:

• Thermal Engineering lead to support multiple projects from concept to post-production across various compute products within Qualcomm.

• Lead package and system cooling architecture through simulation and test while working with various non-thermal disciplines.

• Drive direction and strategy discussions, work cross-functionally with technical leads on tradeoffs, conduct thermal design reviews and presentations, and mentor junior engineers.

• Conduct research on advanced thermal management solutions applicable to complex electronics.

• Develop custom SW solutions to automate thermal modeling and test.

• Perform thermal simulations utilizing CFD tools.

• Design, set up, run, and deliver results for various thermal experiments.

Requirements

• Thorough understanding of electronics cooling technologies; passive, active, and liquid cooling.

• Experience in thermal management of servers and laptops is highly desirable.

• Deep understanding of thermal management design elements including TIM, spreaders, heat sink, vapor chamber, heat pipe, and fan.

• Experience in design, selection, and implementation of thermal management materials in consumer and industrial electronics.

• Academic or industry exposure to 2.5/3D packaging is highly desirable.

• Ability to write scripts in programming languages (i.e. Python, C/C++, MATLAB, etc.) for data analysis & tool development.

• Expertise in conducting CFD simulations and proficiency in SW tools such as ANSYS-Icepak.

• Capability to design and execute thermal tests within a laboratory environment, and hands on experience with airflow and temperature measurements equipment.

• Some experience with 3D geometry CAD tools such as Solidworks or Creo is desirable.

• Excellent presentation, negotiation, and communication skills.

• Ability to clearly communicate complex technical content in written and verbal formats.

• 10+ years of industry experience in electronics cooling.

• Some experience with AI/ML concepts, algorithms, and methodologies is desired.

Education

• Required: MS in Mechanical Engineering

• Preferred: PhD in Mechanical Engineering

Requirements

• Thorough understanding of electronics cooling technologies; passive, active, and liquid cooling.

• Experience in thermal management of servers, laptops, and automotive electronics is highly desirable.

• Deep understanding of thermal management design elements including TIM, spreaders, heat sink, vapor chamber, heat pipe, and fan.

• Experience in design, selection, and implementation of thermal management materials in consumer and industrial electronics.

• Academic or industry exposure to 2.5/3D packaging is highly desirable.

• Ability to write scripts in programming languages (i.e. Python, C/C++, MATLAB, etc.) for data analysis & tool development.

• Expertise in conducting CFD simulations and proficiency in SW tools such as ANSYS-Icepak.

• Capability to design and execute thermal tests within a laboratory environment, and hands on experience with airflow and temperature measurements equipment.

• Some experience with 3D geometry CAD tools such as Solidworks or Creo is desirable.

• Excellent presentation, negotiation, and communication skills.

• Ability to clearly communicate complex technical content in written and verbal formats.

• 10+ years of industry experience in electronics cooling.

• Some experience with AI/ML concepts, algorithms, and methodologies is a plus."

Education

• Required: MS in Mechanical Engineering

• Preferred: PhD in Mechanical Engineering

Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.

:

$180,400.00 - $270,600.00