Bachelor’s degree in Electrical Engineering, Computer Engineering, Physics, a related field, or equivalent practical experience.
4 years of experience working in a Hardware technical environment, or 3 years of experience with an advanced degree.
Experience with Semiconductor Engineering and Microelectronics Fabrication.
Experience with Optoelectronics.
Preferred qualifications:
Master's degree or PhD in Electrical Engineering, Industrial Engineering, Material Science, Operations Management, Computer Science, Physics, or a specialized field or equivalent practical experience.
Experience in the area of Chip-Level Multi-Processing (CMP) or wafer grinding or wafer bonding.