Today’s exceptional challenges require your unique skills. Together, we can build the future of data storage.
ESSENTIAL DUTIES AND RESPONSIBILITIES:
As a metrology engineer, you will be responsible for developing and implementing precise, robust, and high‐throughput solutions to control high volume manufacturing of complex, three dimensional thin film magnetic read/write head structures. Examples of projects include developing automated device inspection recipes to detect defects with machine learning and spectroscopic ellipsometer models to measure thin film thickness and index. To accomplish this objective, you will need to collaborate closely with process engineering teams that support wafer manufacturing operations.
Required:
Preferred:
Skills:
Compensation & Benefits Details
You will be eligible to be considered for bonuses under either Western Digital’s Short Term Incentive Plan (“STI Plan”) or the Sales Incentive Plan (“SIP”) which provides incentive awards based on Company and individual performance, depending on your role and your performance. You may be eligible to participate in our annual Long-Term Incentive (LTI) program, which consists of restricted stock units (RSUs) or cash equivalents, pursuant to the terms of the LTI plan. Please note that not all roles are eligible to participate in the LTI program, and not all roles are eligible for equity under the LTI plan. RSU awards are also available to eligible new hires, subject to Western Digital’s Standard Terms and Conditions for Restricted Stock Unit Awards.
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