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As a Mechanical Design Engineer specializing in multi axis motion systems for wafer scanning with nanometers level vibration and accuracy, you will be at the forefront of creating fast, precise, reliable, and efficient electro-mechanical systems!
Collaborate with multi-functional team such as, controls engineers, systems engineers, and manufacturing engineers to develop concept, details, and iterate on design to optimize performance
Present design reviews, procure prototypes, & work with vendors for various parts, assemblies, motors, bearings, etc.
Design parts, assemblies using Creo/SolidWorks and generate drawings with GD&T for high performance wafer positioning/motion stages, wafer chucks, and related tooling
Perform analysis and simulations, such as structural, thermal, vibration/modal FEAs to optimizecomponents/assembliesfor stiffness, damping, accuracy, and manufacturability
Must have:
Bachelor's degree or higher in Mechanical Engineering or related field with experience in motion systems, precision mechanics, or mechatronics
Proficient in Creo/SolidWorks or similar 3D CAD modeling tools with several years of work experience and in structural, thermal, and vibration/modal FEA
DFM experience with machining, sheet metals, and castings; knowledge of data analysis tools such as Python or MATLAB
Nice to have:
Experience with feedback systems involving high resolution optical encoders/laser interferometers, linear motors, linear guides, air bearings, etc.
Design experience of dynamic X,Y sub-micron positioning stages; vibration and modal testing using accelerometers, impact hammer, etc.
Semiconductor capital equipment design experience
Vibration isolation system, motion control, Simulink, PID servo tuning
Minimum Qualifications
PhD Degree with 0 years related work experience; Master's degree with at least three years' experience; Bachelor's degree with at least five years' experience
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